Polishing Solution Supply Device Flow Distribution
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Solution Overview
Problem
Existing polishing apparatuses for semiconductor devices face challenges in maintaining the polishing rate while reducing the use amount of expensive polishing solutions, and in preventing the adherence and solidification of polishing solutions and residues on the supply device, which can damage substrates and affect quality.
Innovation Solution
A polishing apparatus with a polishing solution supply device that includes multiple supply ports arranged to intersect with the rotating direction of the polishing pad, ensuring a predetermined flow rate distribution of the polishing solution. This apparatus also features a mechanism to clean the supply device outside the polishing pad and a design to suspend the supply device during arm movements, reducing friction torque and maintaining uniform contact with the polishing pad.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If the polishing solution supply amount is reduced to lower operating costs, then the use amount of polishing solution decreases, but the polishing rate of the substrate deteriorates
Solution Approach 1:
The patent applies local quality by providing different polishing solution supply amounts to different regions of the polishing pad. The solution supply device includes a first nozzle for the center region and a second nozzle for the peripheral region, allowing optimized supply distribution that maintains polishing rate while reducing overall solution consumption.
Solution Approach 2:
The patent implements dynamics by making the solution supply device switchable between different nozzles based on polishing conditions. The system can dynamically select between the first nozzle (center supply) and second nozzle (peripheral supply) to adapt to varying polishing requirements and optimize solution usage.
2Quantity of substance
If the polishing solution supply device is placed on the polishing pad to regulate flow, then the flow of polishing solution is improved, but the polishing solution and residues adhere to and solidify on the supply device, causing damage to substrates and affecting quality
Solution Approach 1:
The patent extracts the harmful function by removing the solution supply device from direct contact with the polishing pad surface. The device is positioned above the pad and supplies solution through nozzles without adhering to the surface, preventing residue accumulation and solidification while maintaining effective solution flow.
Solution Approach 2:
The patent introduces an intermediary approach by using nozzles as mediators between the solution source and the polishing pad. The nozzles deliver solution precisely where needed without the supply device itself contacting the pad, thus avoiding direct adhesion of residues to the device structure.
3Quantity of substance
If the polishing solution supply device presses against the polishing pad to regulate flow, then the flow distribution is improved, but the friction torque increases and uniform contact is compromised
Solution Approach 1:
The patent replaces the mechanical pressing system with a non-contact fluid delivery system. Instead of pressing the supply device against the pad to regulate flow, the system uses nozzles positioned above the pad surface to spray solution, eliminating mechanical contact and associated friction torque while maintaining effective flow distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains the polishing rate while reducing the use amount of polishing solution, prevents damage from adhered residues, and stabilizes the polishing performance by ensuring uniform contact and flow distribution.
Implementation Method 1
a plurality of polishing solution supply ports arrayed in a direction intersecting with a rotating direction of the polishing pad in a state that the polishing solution supply device is placed on an upstream side in rotation of the polishing pad relative to the object. The polishing solution supply device supplies the polishing solution, such that the polishing solution supplied from the plurality of polishing solution supply ports has a predetermined flow rate distribution
Implementation Method 2
The polishing apparatus causes the polishing pad and the object to be in contact with each other and to be rotated relative to each other in presence of the polishing solution and thereby polishes the object
Implementation Method 3
a cleaning mechanism configured to supply a cleaning solution to the polishing solution supply device turned to outside of the polishing pad by a turning motion of the arm
Implementation Method 4
a suspending mechanism linked with the arm and with the polishing solution supply device and configured to suspend the polishing solution supply device while the arm is lifted up and lowered by the lifting mechanism
Data Source
AI summary
There is provided an apparatus for polishing, comprising a table configured to support a polishing pad; a polishing head configured to hold a substrate; and a polishing solution supply device configured to supply a polishing solution between the polishing pad and the substrate. The polishing solution supply device comprises a plurality of polishing solution supply ports arrayed in a direction intersecting with a rotating direction of the polishing pad in a state that the polishing solution supply device is placed on an upstream side in rotation of the polishing pad relative to the substrate. The polishing solution supply device supplies the polishing solution, such that the polishing solution supplied from the plurality of polishing solution supply ports has a predetermined flow rate distribution.