Polishing Stage Unevenness for Continuous CMP Slurry Flow
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Solution Overview
Problem
In continuous polishing of film-shaped substrates, the polishing rate decreases due to chemical reactions in CMP slurries, leading to incomplete polishing within predetermined times and potential product quality defects, as the polishing slurry impregnated in the polishing pad is not effectively replaced.
Innovation Solution
A polishing apparatus with a rotatable polishing tool and a polishing stage having an uneven surface shape, where the polishing slurry is supplied through a nozzle and the polishing stage's unevenness facilitates continuous polishing by ensuring consistent slurry flow and pressure distribution, maintaining a high polishing rate by optimizing the concentration of hydrogen peroxide in the slurry and the design of the unevenness shape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If CMP slurry with chemical components is used to increase polishing rate, then polishing speed is improved, but polishing rate decreases when chemical reaction is completed
Solution Approach 1:
The patent optimizes the concentration of hydrogen peroxide in the CMP slurry to maintain effective chemical reaction throughout the polishing process. By carefully controlling the chemical component concentration and adjusting slurry supply parameters, the system sustains high polishing rates without premature reaction completion, thereby resolving the contradiction between initial polishing speed and sustained productivity.
2Duration of action of stationary object
If polishing slurry is impregnated into polishing pad for continuous polishing, then continuous processing is enabled, but slurry is not effectively replaced leading to decreased polishing rate
Solution Approach 1:
The patent implements a continuous slurry supply system that maintains constant flow to the polishing interface. The slurry nozzle is positioned to supply fresh slurry continuously, ensuring that the chemical reaction does not complete and polishability is maintained throughout the extended processing duration, thus sustaining high polishing rates during continuous operation.
Solution Approach 2:
The patent utilizes hydraulic principles through the slurry supply system to ensure effective slurry delivery and replacement. The slurry nozzle is designed to deliver slurry under controlled pressure, enabling continuous replenishment of fresh slurry at the polishing interface, which prevents reaction completion and maintains consistent polishing rates throughout continuous processing.
3Manufacturing precision
If polishing pad is pressed against target object for effective polishing, then polishing quality is improved, but polishing rate decreases over time due to slurry impregnation
Solution Approach 1:
The patent optimizes multiple parameters including hydrogen peroxide concentration, slurry flow rate, and pressing force to maintain a balance between polishing quality and sustained polishing rate. By adjusting these parameters dynamically, the system ensures that the chemical reaction remains effective throughout the process, preventing the typical rate decrease over time while maintaining high-quality polishing results.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves continuous high-quality polishing with a stable and high polishing rate, preventing slurry impregnation issues and maintaining efficiency over time by optimizing the polishing stage's unevenness and hydrogen peroxide concentration.
Implementation Method 1
a polishing slurry in which water is mixed with a granular abrasive called grinding particles is used
Implementation Method 2
polishing using a polishing slurry to which a component having an etching performance is added is generally used, and is called chemical mechanical polishing (CMP)
Implementation Method 3
the polishing stage's unevenness facilitates continuous polishing by ensuring consistent slurry flow and pressure distribution
Data Source
AI summary
A polishing apparatus is a polishing apparatus polishing a target object formed on a surface of a film-shaped substrate. A polishing apparatus includes: a rotatable polishing tool acting on the target object; a slurry nozzle supplying a polishing slurry; and a polishing stage pressing the polishing tool against the target object. A surface of the polishing stage has an unevenness shape.