Polishing Tool With Abrasive Felt For Semiconductor Wafer
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Solution Overview
Problem
Existing polishing methods for semiconductor wafers, such as using free abrasive grains or chemical etching, face inefficiencies and generate significant industrial waste, while methods involving abrasive grains in cloth do not achieve satisfactory polishing quality or efficiency.
Innovation Solution
A polishing tool with abrasive grains dispersed in felt with a density of 0.20 g/cm3 or more and hardness of 30 or more, used in conjunction with a grinding/polishing method that includes rotating the wafer and polishing means in opposite directions, and a grinding/polishing machine that integrates cleaning and drying steps, effectively eliminates processing distortion on semiconductor wafers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If free abrasive grains are used for polishing, then polishing can be performed, but the supply and recovery procedures are tiresome and polishing efficiency is low
Solution Approach 1:
The invention uses a composite polishing disc consisting of a foam material base with abrasive grains dispersed within its pores. This composite structure integrates the polishing function directly into the disc, eliminating the need for separate abrasive grain supply and recovery systems while maintaining effective polishing action.
Solution Approach 2:
The foam material acts as an intermediary carrier that holds and distributes abrasive grains during polishing. The porous structure of the foam allows abrasive grains to be embedded and released effectively, providing a mechanical intermediary solution that simplifies the polishing process.
2Ease of manufacture
If free abrasive grains are used for polishing, then polishing can be performed, but large amounts of free abrasive grains have to be disposed of as industrial wastes
Solution Approach 1:
The polishing disc is designed to be reusable with abrasive grains that remain embedded in the foam structure throughout its service life. The disc itself is discarded after wear, but the abrasive grains are retained within the foam matrix and do not become separate waste materials requiring disposal.
Solution Approach 2:
The integration of abrasive grains within the foam material creates a unified composite structure where abrasive grains are not separate disposable items but integral components of the polishing tool, reducing waste generation.
3Loss of substance
If polishing means constituted by dispersing abrasive grains in cloth is used, then less industrial waste is formed, but polishing efficiency and polishing quality are not sufficiently satisfactory
Solution Approach 1:
The invention changes the physical parameters of the polishing medium by using foam material with specific density (0.05-0.5 g/cm³) and pore structure, rather than traditional cloth. This parameter change enables both waste reduction and improved polishing efficiency through better abrasive grain distribution and contact with the workpiece.
Solution Approach 2:
The foam material with dispersed abrasive grains creates a superior composite structure compared to cloth-based polishing means. The foam's cellular structure provides better mechanical properties and abrasive grain retention, achieving both environmental and performance goals.
4Loss of substance
If polishing means constituted by dispersing abrasive grains in cloth is used, then less industrial waste is formed, but polishing quality is not sufficiently satisfactory
Solution Approach 1:
By changing from cloth to foam material with controlled density and pore size, the polishing surface quality is significantly improved while maintaining the advantage of reduced industrial waste. The foam structure provides more consistent abrasive grain distribution and better contact pressure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high polishing efficiency and quality without generating substantial industrial waste, effectively eliminating processing distortion on semiconductor wafers by using a polishing tool with abrasive grains in felt, which improves heat release and polishing effectiveness.
Implementation Method 1
polishing means composed of felt having a density of 0.20 g/cm3 or more and a hardness of 30 or more, and abrasive grains dispersed in the felt
Implementation Method 2
improves heat release and polishing effectiveness
Data Source
AI summary
A polishing tool comprising a support member, and polishing means fixed to the support member. The polishing means is composed of felt having a density of 0.20 g/cm3 or more and a hardness of 30 or more, and abrasive grains dispersed in the felt. A polishing method and apparatus involving pressing the polishing means against a surface of a workpiece to be polished, while rotating the workpiece and also rotating the polishing tool.