Polyacetal-Bridged Curable Composition for Low-Temperature Debonding
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Solution Overview
Problem
Existing detachable compositions for joint connections require harsh conditions, leave residues, or contain non-polymerizing compounds, limiting their applicability and efficiency.
Innovation Solution
A curable composition comprising epoxy-containing compounds, oxetanes, or (meth)acrylates, with a polyacetal-bridged resin component that can be detached or dissolved in an aqueous medium at low temperatures without residues, featuring variable glass transition temperatures and wide mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional detachable compositions are used, then joint connections can be detached, but harsh conditions are required and residues are left
Solution Approach 1:
The patent changes the chemical composition parameters by incorporating polyacetal resin and carboxylic acid components in specific proportions (0.1-10 wt% polyacetal, 0.01-5 wt% carboxylic acid). This compositional parameter change enables detachment under mild conditions without residues, resolving the contradiction between ease of detachment and avoidance of harsh conditions.
Solution Approach 2:
The patent creates a composite adhesive system combining polyacetal resin with carboxylic acid components. This composite material exhibits both strong bonding properties and controlled detachability under mild conditions, eliminating the need for harsh detachment methods while leaving no residues.
2Ease of operation
If support structures are made from water-soluble polymers or waxes, then they can be washed out easily, but the degree of crosslinking is low resulting in poor mechanical properties
Solution Approach 1:
The patent adjusts the crosslinking density parameters by controlling the ratio of polyacetal resin to carboxylic acid components and selecting appropriate polyacetal molecular weights (10,000-1,000,000 g/mol). This enables achieving adequate cohesion and mechanical properties while maintaining water-washability for support structure removal.
Solution Approach 2:
The patent develops a composite support material system where polyacetal resin provides the base structure and carboxylic acid components enable crosslinking. This composite achieves both mechanical integrity for support functions and water-solubility for easy removal after use.
3Ease of operation
If high filling levels of heat-expandable microspheres are used, then detachment degree is high, but shearing stability is low affecting processability
Solution Approach 1:
The patent changes the reinforcement strategy by using polyacetal resin with controlled molecular weight and branching instead of high levels of heat-expandable microspheres. This maintains adequate shearing stability while achieving detachment through the polyacetal-carboxylic acid reaction mechanism, avoiding the need for high microsphere fillings.
4Ease of operation
If epoxy resins with acetal bonds are used, then detachment is possible, but 1 week of storage is required and organic solvents are mandatory
Solution Approach 1:
The patent changes the chemical structure parameters by using polyacetal resin with specific acetal bond configurations that are more susceptible to hydrolysis. Combined with carboxylic acid components, this enables rapid detachment through acid-catalyzed hydrolysis without requiring long storage times or organic solvents, achieving detachment in water at mild temperatures.
5Ease of operation
If acetal-based (meth)acrylates are used, then detachment is possible, but glass transition temperature is low limiting application range
Solution Approach 1:
The patent creates a composite system where polyacetal resin provides detachment functionality and carboxylic acid components enable crosslinking. This composite achieves both detachability and elevated glass transition temperatures, expanding the application range beyond low-temperature adhesives to include semiconductor and electronics applications requiring higher thermal stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition allows for efficient detachment and dissolution of joint connections at low temperatures, providing a wide range of mechanical properties and avoiding residue formation.
Implementation Method 1
the composition allows for efficient detachment and dissolution of joint connections at low temperatures, providing a wide range of mechanical properties and avoiding residue formation
Data Source
AI summary
The invention relates to a curable composition comprising at least one curable resin component and at least one curing agent and/or one initiator for the polymerization of the curable resin compound. Moreover, the composition comprises at least one non-linear polyacetal-bridged resin component having a large number of acetal functions and functional groups of resin component (A).