Polyacid Salt Resist Composition for High-Sensitivity Fine Patterning
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Solution Overview
Problem
The existing resist compositions face a trade-off between sensitivity and resolution, making it difficult to achieve high sensitivity while maintaining high resolution for fine circuit patterns in semiconductor lithography.
Innovation Solution
A resist composition containing a resin component whose solubility in a developer changes by the action of an acid, combined with a polyacid salt, such as polyoxomolybdate, polyoxotungstate, polyoxoniobate, or polyoxotantalate anions, and organic sulfonium, iodonium, or quaternary ammonium cations, which can absorb light sources like DUV, XUV, EUV, or electron beams, along with an acid generator or acid diffusion control agent.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sensitivity of a resist to an exposure light source is improved, then the sensitivity is improved, but the resolution is deteriorated
Solution Approach 1:
The patent uses a composite resist composition containing a resin component, polyacid salt, and acid generator. The polyacid salt serves dual functions: it absorbs exposure light to generate acid (improving sensitivity) and its polyoxometalate anion structure provides high refractive index and absorption coefficient without deteriorating resolution. This composite approach resolves the sensitivity-resolution trade-off by combining materials with complementary properties.
Solution Approach 2:
The patent changes the chemical composition parameters of the resist, specifically incorporating polyacid salts with polyoxometalate anions (such as polyoxomolybdate, polyoxotungstate) that have unique optical properties. By adjusting the molecular structure and composition of the polyacid salt, the resist achieves high sensitivity to exposure light while maintaining fine pattern resolution, fundamentally altering the parameter space of resist materials.
2Reliability
If a resist composition uses conventional materials to achieve high sensitivity, then the sensitivity is improved, but the ability to maintain high resolution for fine circuits is worsened
Solution Approach 1:
The patent creates a novel composite resist system combining resin component, polyacid salt, and acid generator. The polyacid salt with polyoxometalate anion is the key composite material that provides both high light absorption (for sensitivity) and maintains pattern fidelity (for resolution). This composite structure overcomes the limitations of conventional single-material resist systems.
Solution Approach 2:
The patent achieves different functional properties in different regions of the resist composition. The polyacid salt distributes throughout the resist film, with its polyoxometalate anions providing localized high absorption centers for acid generation while the overall composition maintains uniform solubility characteristics for precise pattern formation. This local functional differentiation enables simultaneous high sensitivity and resolution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides a resist suitable for various light sources, enabling high sensitivity and resolution, suitable for pattern formation in semiconductor lithography.
Implementation Method 1
a polyacid salt that can highly absorb a light source, such as DUV, XUV, EUV, or an electron beam
Implementation Method 2
a resin component whose solubility in a developer changes by the action of an acid
Data Source
AI summary
To provide a novel resist composition containing (A) a resin component whose solubility in a developer changes by the action of an acid and (B) a polyacid salt, and to provide a pattern forming method thereof.