Polyamic Acid Adhesive for Optical Module Bonding

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional adhesives for optical modules face challenges with low refractive index, decreased strength at high temperatures, and limited transparency, making them unsuitable for durable optical applications.

Innovation Solution

A method involving a polyamic acid-based adhesive layer with a refractive index of 1.55 to 2.0, formed by applying a polyamic acid solution to a substrate and a prism, followed by planarization and bonding under controlled temperature and pressure, to create an adhesive structure with improved strength and transparency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If conventional adhesive or adhesive film is used for optical module, then the refractive index is low, but the transparency and optical signal transmission are insufficient

Engineering Contradiction:
ImprovetransparencyVSAvoidrefractive index matching
Core Design Contradiction:
Illumination intensityVSReliability

Solution Approach 1:

The patent changes the chemical composition parameters of the adhesive material from conventional adhesives to polyamic acid-based materials, which inherently possess higher refractive index (1.55-2.0) and better transparency. This parameter change in material composition simultaneously improves both refractive index matching and optical transmission properties.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite polyamic acid-based adhesive layers that combine the properties of high refractive index and high transparency. The adhesive structure comprises multiple layers including polyamic acid adhesive layers with specific compositions that achieve both mechanical bonding and optical compatibility.

Inventive Principle:
Principle #40Composite materials

2Strength

If conventional adhesive is used for optical module, then the initial bonding strength is adequate, but the strength decreases at high temperature

Engineering Contradiction:
Improveadhesive strengthVSAvoidhigh temperature resistance
Core Design Contradiction:
StrengthVSTemperature

Solution Approach 1:

The patent changes the thermal stability parameters by selecting polyamic acid-based materials with high glass transition temperatures and excellent thermal resistance. The adhesive layers are designed to maintain their mechanical strength and bonding properties at elevated temperatures, solving the high-temperature degradation issue of conventional adhesives.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs a multi-layer adhesive structure where the polyamic acid-based adhesive layers provide long-term thermal stability. The specific formulation and curing process create a durable bonding interface that resists thermal degradation throughout the product lifecycle.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Reliability

If polyimide is used for adhesive layer, then the durability and high temperature strength are improved, but the transparency is reduced due to non-transparent nature

Engineering Contradiction:
ImprovedurabilityVSAvoidtransparency
Core Design Contradiction:
ReliabilityVSIllumination intensity

Solution Approach 1:

The patent changes the optical parameters by using polyamic acid-based materials instead of conventional polyimide. The polyamic acid structure provides both the desired mechanical durability and optical transparency, with refractive index of 1.55-2.0 and high light transmittance, eliminating the transparency-durability trade-off.

Inventive Principle:
Principle #35Parameter changes

4Ease of manufacture

If adhesive layer is applied without planarization, then the manufacturing process is simple, but the bonding quality and void formation are poor

Engineering Contradiction:
Improveprocess simplicityVSAvoidbonding quality
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies planarization treatment to the substrate surface before applying the adhesive layer. This preliminary action ensures a flat, uniform surface that promotes even adhesive distribution and complete contact between bonding surfaces, preventing void formation and improving bonding quality without significantly complicating the manufacturing process.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides an adhesive structure with enhanced mechanical and chemical resistance, high transmittance, and refractive index matching, suitable for optical modules with reduced optical signal loss and voids, maintaining strength even at elevated temperatures.

Implementation Method 1

the bonding of the adhesive layer to the prism adhesive layer may include forming intermolecular van der Waals force, an electric dipole bond or an induced dipole bond between a polyamic acid included in the polyamic acid layer and the active functional group

Methodology Applied
Scientific EffectVan der Waals force: Van der Waals Force

Implementation Method 2

the bonding of the adhesive layer to the prism adhesive layer may include forming intermolecular van der Waals force, an electric dipole bond or an induced dipole bond between a polyamic acid included in the polyamic acid layer and the active functional group

Methodology Applied
Scientific EffectElectric dipole bond:

Implementation Method 3

the bonding of the adhesive layer to the prism adhesive layer may include forming intermolecular van der Waals force, an electric dipole bond or an induced dipole bond between a polyamic acid included in the polyamic acid layer and the active functional group

Methodology Applied
Scientific EffectInduced dipole bond:

Implementation Method 4

the bonding of the adhesive layer to the prism adhesive layer may include infiltrating a polyamic acid included in the polyamic acid layer into the adhesive layer or the prism adhesive layer, and solidifying the infiltrated polyamic acid

Methodology Applied
Scientific EffectInfiltration: Permeation

Implementation Method 5

disposing the prism on the substrate structure such that the polyamic acid layer contacts the adhesive layer and the prism adhesive layer, and applying pressure to the prism and the substrate structure to bond the adhesive layer to the prism adhesive layer

Methodology Applied
Scientific EffectPressure bonding: Pressure Increase

Data Source

PatentUS11970642B2Method for bonding objects using thermoset polyimide layers
Publication Date: 2024.04.30 OPROCESSOR INC
  • US11970642B2 patent drawing
  • US11970642B2 patent drawing
  • US11970642B2 patent drawing

AI summary

According to embodiments, a method for manufacturing an optical module may include: applying a polyamic acid solution to an upper surface of a substrate structure to form an adhesive layer; forming an active functional group on an upper surface of the adhesive layer; applying a polyamic acid solution to a first surface of a prism to form a prism adhesive layer; forming a polyamic acid layer on at least one of a planarized upper surface of the adhesive layer and a lower surface of the prism adhesive layer; disposing the prism on the substrate structure such that the polyamic acid layer contacts the adhesive layer and the prism adhesive layer; and applying pressure to the prism and the substrate structure to bond the adhesive layer to the prism adhesive layer.