Polyamic Acid Coating Film for Semiconductor Foreign Matter Removal
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Solution Overview
Problem
In semiconductor device production, particularly during the temporarily bonding step, foreign matters such as peeling residues from bonding agents often remain on substrates, which are difficult to completely remove using conventional cleaning methods like organic solvents or chemical agents, leading to defective products and reduced yield.
Innovation Solution
A composition forming a coating film using a polymer, such as polyamic acid derived from tetracarboxylic dianhydride and diamine compounds, is applied to the substrate, baked, and then used in the bonding process. This coating film is soluble in developers, allowing for the simultaneous removal of foreign matters and the bonding layer during the peeling step.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If bonding agents are used to bond wafers to supporting substrates, then bonding strength is improved, but foreign matters (peeling residues) remain on substrates after peeling
Solution Approach 1:
A coating film is applied to the wafer surface before bonding to prevent bonding agent adhesion. This preliminary protective layer is then removed after peeling, taking the bonding agent residues with it, thus preventing contamination of the underlying substrate.
Solution Approach 2:
The coating film acts as an intermediary layer between the wafer and bonding agent. It provides a sacrificial surface that the bonding agent adheres to instead of the wafer, allowing clean separation after bonding while removing residues through developer treatment.
2Ease of operation
If conventional cleaning methods (organic solvents or liquid chemical agents) are used to remove foreign matters, then cleaning is performed, but complete removal of peeling residues is difficult
Solution Approach 1:
The coating film is designed with specific chemical properties (solubility in developer) that differ from conventional cleaning approaches. By changing the chemical parameter of the protective layer to be developer-soluble, complete residue removal is achieved through simple developer treatment rather than complex cleaning processes.
3Ease of operation
If a coating film is applied before bonding, then foreign matters can be removed easily, but additional process steps are required
Solution Approach 1:
The coating film application step is merged with the existing bonding process flow. The film is applied once before bonding, and its removal is combined with the peeling step, so that one additional material addition enables both protection during bonding and easy removal afterward without requiring separate complex processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively removes foreign matters without damaging the substrate, significantly reducing defective products and improving the yield of high-quality wafers by ensuring complete removal of residues, even in the presence of heat and chemical processes.
Implementation Method 1
a baked material of an applied film formed from the composition... removing the coating film together with the foreign matters using a developer
Data Source
AI summary
A simplified method for removing foreign matters formed on a substrate in a semiconductor device manufacturing process; and a composition for forming a coating film for foreign matter removal use, which can be used in the method. A coating film is formed on a semiconductor substrate using a composition preferably containing a polyamic acid produced from (a) a tetracarboxylic dianhydride compound and (b) a diamine compound having at least one carboxyl group or a polyamic acid produced from (a) a tetracarboxylic dianhydride compound, (b) a diamine compound having at least one carboxyl group and (c) a diamine compound, and then foreign matters occurring on the coating film are removed together with the coating film by the treatment with a developing solution.