Polyamic Acid LCP Composition for PCB Thermal Expansion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional printed circuit board materials, such as bismaleimide-triazine and glass epoxy resins, fail to provide satisfactory mechanical properties, low permittivity, high heat resistance, low thermal expansion, and low moisture absorption required for next-generation electronic devices.
Innovation Solution
A composition comprising a polyamic acid with crosslinkable functional groups and a liquid crystal polymer or liquid crystalline thermoset oligomer, combined with an organic solvent, which forms a high-temperature cured film with excellent heat resistance and low thermal expansion, suitable for producing printed circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional materials such as bismaleimide-triazine and glass epoxy resins are used, then manufacturing experience and availability are improved, but mechanical properties, heat resistance, thermal expansion, and moisture absorption performance deteriorate
Solution Approach 1:
The patent uses a composite material system combining polyamic acid with crosslinkable functional groups and liquid crystal polymer or liquid crystalline thermoset oligomer. This composite approach achieves superior heat resistance (glass transition temperature ≥250°C) and low thermal expansion (CTE ≤20 ppm/°C) while maintaining manufacturability through established prepreg and lamination processes.
2Ease of manufacture
If conventional materials such as bismaleimide-triazine and glass epoxy resins are used, then ease of manufacture is improved, but mechanical properties and permittivity deteriorate
Solution Approach 1:
The composite of polyamic acid and liquid crystal polymer creates a material system that delivers excellent mechanical properties including high strength and low thermal expansion coefficient. The crosslinkable functional groups in polyamic acid form a three-dimensional crosslinked network that enhances mechanical strength while maintaining ease of manufacture through standard PCB fabrication processes.
3Adaptability or versatility
If conventional materials such as bismaleimide-triazine and glass epoxy resins are used, then availability is improved, but moisture absorption and thermal expansion performance deteriorate
Solution Approach 1:
The patent changes the chemical composition parameters by introducing crosslinkable functional groups (vinyl, allyl, or acetylene groups) at the ends of polyamic acid chains and combining with liquid crystal polymer. This compositional change results in a cured film with low moisture absorption and low thermal expansion coefficient (≤20 ppm/°C), suitable for high-reliability electronic devices.
4Reliability
If the composition is cured at high temperature, then heat resistance is improved, but processing complexity increases
Solution Approach 1:
The patent achieves high heat resistance (glass transition temperature ≥250°C) by controlling the chemical composition parameters - specifically using polyamic acid with crosslinkable functional groups combined with liquid crystal polymer in specific ratios. The curing process, while requiring elevated temperatures, follows standard PCB manufacturing protocols and does not introduce excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a glass transition temperature greater than or equal to 250°C and a coefficient of thermal expansion not higher than 20 ppm/°C, making it suitable for highly integrated, smaller, and lighter electronic devices, outperforming comparative materials in thermal and mechanical properties.
Implementation Method 1
a polyamic acid having one or two crosslinkable functional groups introduced at one or both ends thereof
Implementation Method 2
a liquid crystal polymer (LCP) or a liquid crystalline thermoset (LCT) oligomer
Data Source
AI summary
A composition for producing a printed circuit board is provided. The composition includes a polyamic acid having one or two crosslinkable functional groups introduced at one or both ends thereof, a liquid crystal polymer (LCP) or a liquid crystalline thermoset (LCT) oligomer, and an organic solvent. Therefore, the composition can be used as a material for next-generation boards that are becoming gradually lighter in weight and smaller in thickness and size. Further provided is a printed circuit board produced using the composition.