Polyamide Adhesive Composite Layer for Cryogenic Strength Retention
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Solution Overview
Problem
Traditional polyamide materials shrink severely in ultra-low temperatures and fail to maintain mechanical strength at room temperature, posing a mechanical strength in ultra-low temperatures and fail to maintain their mechanical strength at room temperature.
Innovation Solution
A polyamide adhesive composed of polyamide resin, bisphenol epoxy resin, imidazole curing agent, and silane coupling agent, with specific proportions and preparation methods, is used to form an insulating composite layer with improved thermal insulation and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional polyamide materials are used, then thermal insulation performance is provided, but mechanical strength is lost in ultra-low temperature environments
Solution Approach 1:
The patent uses a composite adhesive system combining polyamide resin with epoxy resin, curing agents, and silane coupling agents. This composite formulation allows the material to maintain both thermal insulation properties and mechanical strength in ultra-low temperature environments, resolving the contradiction between insulation performance and strength retention.
Solution Approach 2:
The patent modifies the chemical composition parameters of the polyamide material by introducing specific ratios of epoxy resin (10-30 parts), curing agents (0.01-0.5 parts), and silane coupling agents (0.1-2 parts). These parameter changes enable the material to maintain mechanical strength at room temperature while providing thermal insulation, preventing the severe shrinkage and strength loss that occurs with traditional polyamide materials.
2Strength
If polyamide resin is used for adhesive formulation, then bonding capability is achieved, but severe shrinkage occurs in ultra-low temperatures
Solution Approach 1:
The patent introduces epoxy resin as an intermediary component that modifies the polyamide resin's behavior in low temperatures. The epoxy resin acts as a mediator that prevents severe shrinkage while maintaining bonding capability, allowing the adhesive to retain its shape and dimensional stability in ultra-low temperature environments.
Solution Approach 2:
By changing the chemical composition parameters to include specific amounts of epoxy resin (10-30 parts) and curing agents (0.01-0.5 parts), the patent alters the material's thermal and mechanical properties. This parameter modification prevents the severe shrinkage that would otherwise occur in ultra-low temperatures while preserving adhesive bonding capability.
3Ease of operation
If conventional adhesive formulations are used, then ease of application is maintained, but reliability fails in ultra-low temperature conditions
Solution Approach 1:
The patent develops a composite adhesive formulation combining polyamide resin with epoxy resin, curing agents, and silane coupling agents. This composite material maintains ease of application while significantly improving reliability in ultra-low temperature conditions, preventing the performance failure that occurs with conventional adhesive formulations.
Solution Approach 2:
The patent modifies the adhesive formulation parameters by incorporating specific ratios of epoxy resin (10-30 parts), curing agents (0.01-0.5 parts), and silane coupling agents (0.1-2 parts). These parameter changes enhance the adhesive's reliability in ultra-low temperature environments while preserving ease of application during the bonding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite layer exhibits enhanced thermal insulation, flexibility, and mechanical strength at both low and room temperatures, preventing cracking and ensuring safety in liquefied natural gas transportation.
Implementation Method 1
adding the bisphenol epoxy resin, the imidazole curing agent and the silane coupling agent into the polyamide solution, and stirring for reaction
Implementation Method 2
0.1-2 parts of a silane coupling agent
Implementation Method 3
adding the polyamide resin into an organic solvent, and stirring for dissolution, to obtain a polyamide solution
Implementation Method 4
the polyamide adhesive (with a solid content of 15%-30%)
Data Source
AI summary
A polyamide adhesive and an insulating composite layer, and preparation methods and uses thereof are provided. The polyamide adhesive includes the following raw materials in parts by weight: 70-90 parts of polyamide resin, 10-30 parts of bisphenol epoxy resin, 0.01-0.5 parts of an imidazole curing agent and 0.1-2 parts of a silane coupling agent. The preparation method includes: (1) weighing each raw material; (2) adding polyamide resin into an organic solvent, and stirring for dissolution; (3) adding bisphenol epoxy resin, imidazole curing agent and silane coupling agent, and stirring for reaction to obtain the product.