Polyamide 3D Printing Filament for Heat and Humidity Stability

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Solution Overview

Problem

Existing extrusion-based 3D printing methods using polyamides like PA12 and PA6 face limitations due to low glass transition temperatures and moisture sensitivity, making them unsuitable for high-temperature applications and environments with varying humidity, while requiring a drying step before use.

Innovation Solution

A filament comprising a polyamide derived from 4,4'-diaminodicyclohexylmethane with a trans/trans configuration, combined with specific dicarboxylic acids, offering high glass transition temperatures and low melting points, suitable for 3D printing applications requiring high temperature resistance and stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If polyamides like PA12 and PA6 are used for 3D printing, then the melting temperature is kept low (below 280°C), but the glass transition temperature remains low (below 50°C) making them unsuitable for high temperature applications

Engineering Contradiction:

Improveglass transition temperatureVSAvoidtemperature resistance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent changes the chemical structure parameters of the polyamide by incorporating 4,4'-diaminodicyclohexylmethane moieties with specific trans/trans configuration (at least 30 mol.%) to raise the glass transition temperature from below 50°C to above 90°C, while maintaining the melting temperature below 280°C through careful selection of chain length (n=12-20)

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite polyamide structure combining cycloaliphatic diamine units (4,4'-diaminodicyclohexylmethane) with aliphatic chain segments (n=12-20), where the cycloaliphatic units provide high Tg and the aliphatic chains maintain low Tm, achieving both high temperature resistance and printability

Inventive Principle:

Principle #40Composite materials

2Ease of manufacture

If polyamides like PA6 are used for 3D printing, then they are easy to process, but they absorb excessive moisture from the environment causing dramatic Tg decrease and lower modulus

Engineering Contradiction:

Improveprocessing easeVSAvoidmoisture absorption

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent modifies the polyamide's chemical composition by incorporating hydrophobic cycloaliphatic diamine units (4,4'-diaminodicyclohexylmethane) which reduce moisture absorption compared to conventional polyamides like PA6, thereby preventing Tg depression and modulus reduction in humid environments while maintaining processability

Inventive Principle:

Principle #35Parameter changes

3Reliability

If polyamides with high glass transition temperature are developed for high temperature applications, then temperature resistance improves, but compatibility with standard printers requiring low melting temperature may be lost

Engineering Contradiction:

Improvetemperature resistanceVSAvoidprinter compatibility

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent precisely controls two parameters: the chain length n (set between 12-20 to maintain low Tm below 280°C) and the trans/trans configuration content (at least 30 mol.% to ensure high Tg above 90°C), achieving a balanced polyamide that is compatible with standard printers while providing high temperature resistance

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent designs a composite molecular structure where rigid cycloaliphatic units (providing high Tg) are combined with flexible aliphatic chains of controlled length (providing low Tm), creating a polyamide that simultaneously meets the requirements of both high temperature applications and standard 3D printing equipment

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The polyamide filament maintains mechanical properties at elevated temperatures and reduces moisture absorption, ensuring compatibility with standard printers and support materials, enabling the production of durable 3D objects.

Implementation Method 1

These polyamides however have a low glass transition temperatures (Tg), e.g. below 50°C, which make them unsuitable to prepare articles used in applications requiring a high temperature resistance

Methodology Applied

Scientific EffectGlass transition:

Implementation Method 2

In particular for PA 6, it absorbs so much moisture when exposed to ambient environment that its Tg decreases dramatically

Methodology Applied

Scientific EffectMoisture absorption: Absorption (physical)

Implementation Method 3

The extruded part material fuses to previously deposited part material, and solidifies upon a drop in temperature

Methodology Applied

Scientific EffectMelting: Melting

Data Source

PatentEP4337816B1Filament containing polyamide (PA) polymer and its use for additive manufacturing

Publication Date: 2025.12.03 SYENSQO SPECIALTY POLYMERS USA LLC

AI summary

The present invention relates to a process for manufacturing a three-dimensional (3D) article, part or composite material, from a filament comprising a polyamide (PA) presenting 4,4'-diaminodicyclohexylmethane moieties, as well as to such filament. The present invention also relates to the 3D article, part or composite material 5 obtainable from such process, as well as the use of the article, part or composite materials in oil and gas applications, automotive applications, electric and electronic applications, aerospace, medical and consumer goods.