Polyamide-imide Film Solvent Resistance and Adhesion
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Solution Overview
Problem
Polyimide-based films used in display devices face issues with mechanical and optical property deterioration and functional layer detachment when exposed to solvents during post-processing, requiring a solution that enhances mechanical properties, optical properties, and solvent resistance.
Innovation Solution
A polyamide-imide-based film with a TGA weight loss area value of 0.01%·min/° C. or less is developed, prepared by polymerizing a diamine compound, a dianhydride compound, and a dicarbonyl compound, and thermally treated to improve adhesion to functional layers and solvent resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a polyimide-based film is used in display devices, then it provides basic heat resistance and chemical resistance, but the mechanical and optical properties deteriorate when exposed to solvents during post-processing
Solution Approach 1:
The patent changes the chemical composition parameters of the polyimide film by incorporating specific additives and modifying the molecular structure. This includes controlling the weight average molecular weight within a specific range (20,000-100,000) and adding crosslinking agents to create a three-dimensional network structure, thereby improving both solvent resistance and mechanical properties simultaneously
Solution Approach 2:
The patent creates a composite polyimide film by combining polyimide base resin with specific additives including crosslinking agents, fillers, and plasticizers. This composite structure enhances the film's chemical resistance to solvents while maintaining mechanical strength through the synergistic effects of different components
2Reliability
If a polyimide-based film is used in display devices, then it provides basic heat resistance and chemical resistance, but functional layers detach from the film during post-processing
Solution Approach 1:
The patent modifies the surface energy parameters of the polyimide film through additive incorporation and crosslinking density control. This creates optimal surface characteristics that enhance adhesion between the film and functional layers, preventing detachment during solvent exposure while maintaining the film's chemical resistance
Solution Approach 2:
The patent introduces crosslinked polyimide structures and surface-modifying additives that act as intermediaries between the polyimide film and functional layers. These intermediary structures create strong bonding interfaces that resist solvent penetration and prevent layer detachment
3Stability of the object's composition
If the polyimide film is thermally treated to improve adhesion, then functional layer adhesion improves, but optical properties may deteriorate
Solution Approach 1:
The patent performs preliminary crosslinking and surface modification during the film manufacturing process itself, creating adhesion-promoting structures before the film is applied to display devices. This eliminates the need for subsequent high-temperature thermal treatment that could damage optical properties, as adhesion is already optimized in advance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polyamide-imide-based film maintains excellent optical and mechanical properties, reduces detachment of functional layers, and enhances solvent resistance, thereby improving the quality reliability and product yield of display devices and cover windows.
Implementation Method 1
thermally treating the gel sheet
Data Source
AI summary
The embodiments aim to provide a polyamide-imide-based film that has a TGA weight loss area value (TDA) of 0.01%·min/° C. or less and is excellent in mechanical properties, optical properties, and the suitability for post-processing, a process for preparing the same, and a cover window and a display device comprising the same.