Polyamide-imide Resin Insulating Paint for High-Voltage Partial Discharge Resistance
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Solution Overview
Problem
Existing polyamide-imide resin insulating paints have high permittivity, which complicates achieving both high heat resistance and mechanical characteristics, making it difficult to cope with high-voltage drives and partial discharge in insulation wires.
Innovation Solution
A polyamide-imide resin insulating paint with a specific molecular structure, containing an aromatic diisocyanate or diamine component with three or more benzene rings, and a balanced ratio of amide and imide groups, reducing permittivity while maintaining heat resistance and mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional polyamide-imide resin insulating paint is used, then heat resistance and mechanical characteristics are maintained, but permittivity is high causing partial discharge degradation
Solution Approach 1:
The patent changes the molecular structure parameters of the polyamide-imide resin by incorporating aromatic diisocyanate or diamine components with three or more benzene rings, and controlling the amide/imide group ratio to be 1.05 or more. This parameter change reduces the permittivity of the resin film from conventional high levels to below 3.5, thereby improving partial discharge resistance while maintaining heat resistance and mechanical properties.
2Reliability
If polyamide-imide resin with high amide/imide ratio is used, then partial discharge resistance improves, but manufacturing complexity increases
Solution Approach 1:
The patent specifies precise parameter ranges for easy manufacturing: aromatic diisocyanate or diamine components with three or more benzene rings, amide/imide group ratios of 1.05 or more, and molecular weights within specific ranges. These standardized parameters simplify quality control and manufacturing while achieving the desired low permittivity and high partial discharge resistance.
Data Source
AI summary
A polyamide-imide resin insulating paint according to the present invention includes polyamide-imide resin containing no halogen element in its molecular chain which is dissolved in a polar solvent, in which the polyamide-imide resin contains an aromatic diisocyanate component (A) having three or more benzene rings or an aromatic diamine component (E) having three or more benzene rings in a monomer, and a ratio M/N between a molecular weight (M) of the polyamide-imide resin per repeat unit and an average number (N) of amide groups and imide groups is equal to or more than 200.