Polyamide-Imide Primer Resin for Heat-Cycle Adhesion in Semiconductors
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Solution Overview
Problem
Conventional resin materials used in semiconductor devices face challenges in achieving a balance between heat resistance and flexibility, leading to unsatisfactory adhesion between resin sealing members and substrates or semiconductor elements during high-temperature heat cycle testing, and they also require improved printability for effective application.
Innovation Solution
A polyamideimide resin with specific structural units, such as those derived from compounds represented by formulas (I) and (II), is developed, which exhibits a glass transition temperature of 250°C or higher, providing excellent heat resistance, flexibility, and printability, and is used to form a primer layer for enhanced adhesion between resin sealing members and substrates or semiconductor elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a resin material with high glass transition temperature is used to improve heat resistance, then heat resistance is improved, but flexibility deteriorates
Solution Approach 1:
The patent applies parameter changes by precisely controlling the glass transition temperature to be 250°C or higher while adjusting the elastic modulus to maintain flexibility. This is achieved by modifying the chemical structure of the polyamideimide resin, specifically by incorporating specific structural units (Ia) and (IIa) with controlled proportions, thereby changing the material parameters to simultaneously achieve heat resistance and flexibility.
Solution Approach 2:
The patent uses composite materials by creating a polyamideimide resin that combines multiple structural units (Ia) and (IIa) in specific ratios. This composite structure at the molecular level allows the material to exhibit both high glass transition temperature for heat resistance and appropriate elastic modulus for flexibility, resolving the contradiction between these two properties.
2Ease of manufacture
If conventional resin materials are used, then manufacturing is simple, but adhesion between resin sealing members and substrates deteriorates during heat cycle testing
Solution Approach 1:
The patent changes the chemical and physical parameters of the resin material by specifying a glass transition temperature of 250°C or higher and controlling the elastic modulus within 0.5-3.0 GPa. These parameter changes enable the resin to maintain strong adhesion during heat cycle testing while preserving ease of application through conventional coating methods.
Solution Approach 2:
The polyamideimide resin acts as an intermediary material between the substrate and the resin sealing member. By positioning this resin with specific properties (high Tg, controlled elastic modulus) at the interface, it mediates the thermal and mechanical stresses during heat cycling, thereby maintaining reliable adhesion between the components.
3Volume of moving object
If resin materials are used for sealing, then miniaturization is achieved, but separation between members occurs during heat cycle testing
Solution Approach 1:
The patent changes the thermal and mechanical parameters of the sealing resin by specifying a glass transition temperature of 250°C or higher and controlling the elastic modulus. These parameter changes enable the miniaturized device to withstand heat cycle testing without separation, as the resin maintains its protective function despite the reduced device size and increased thermal stresses.
Data Source
Figure 1
AI summary
A polyamideimide resin containing a structural unit (Ia) derived from a compound represented by formula (I) and a structural unit (IIa) derived from a compound represented by formula (II), and having a glass transition temperature of 250°C or higher. In formulas (I) and (II), each of R1 to R8 independently represents a hydrogen atom or at least one substituent selected from the group consisting of alkyl groups of 1 to 9 carbon atoms, alkoxy groups of 1 to 9 carbon atoms and halogen atoms, and each Y independently represents an amino group or an isocyanate group.