Polyamide-imide Photosensitive Resin for Low-Temperature Curing
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Solution Overview
Problem
Current photosensitive resins used in semiconductor and display production face issues such as hydrolysis, low adhesion to substrates, inadequate chemical and heat resistance, and thermal damage during curing, which affect the formation of ultrafine patterns and the stability of electronic devices.
Innovation Solution
A photosensitive resin composition comprising a polyamide-imide resin with specific repeating units and a photoacid generator, allowing for efficient curing at low temperatures and providing excellent mechanical properties and photosensitivity, is developed. This composition includes a positive-type and negative-type formulation, each with distinct chemical structures and additives for enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If polyamide acid or polyamic acid is used as photosensitive resin, then fine precision processing is enabled, but the material is easily hydrolyzed by water or air, resulting in insufficient preservability and stability
Solution Approach 1:
The patent changes the chemical parameters of the photosensitive resin by using polyamide-imide resin with specific repeating units containing hydroxyl or carboxyl groups instead of polyamide acid or polyamic acid. This parameter change maintains the ability for fine precision processing while significantly improving hydrolytic stability and preservability.
Solution Approach 2:
The patent creates a composite photosensitive resin composition by combining polyamide-imide resin with specific chemical structures (containing hydroxyl or carboxyl groups in the repeating units) and photoacid generators. This composite approach enables both fine precision processing and improved stability against hydrolysis.
2Manufacturing precision
If polyamic acid is used as photosensitive resin, then fine precision processing is enabled, but adhesion to substrate is low and physical properties of electronic wiring and substrate deteriorate due to high temperature application
Solution Approach 1:
The patent changes the chemical composition parameter from polyamic acid to polyamide-imide resin with specific repeating units. This parameter change improves adhesion to substrate while maintaining fine precision processing capability and reducing sensitivity to high temperature application.
3Productivity
If conventional photosensitive resins are used, then processing is performed, but chemical resistance, heat resistance, and electrical properties in cured state are not sufficient, and adhesion to metal substrate is insufficient causing peeling during development or curing process
Solution Approach 1:
The patent develops a composite photosensitive resin composition using polyamide-imide resin with specific repeating units containing hydroxyl or carboxyl groups combined with photoacid generators. This composite structure provides sufficient chemical resistance, heat resistance, and adhesion to metal substrates while maintaining processing efficiency.
Solution Approach 2:
The patent changes the chemical composition from conventional photosensitive resins to polyamide-imide resin with specific functional groups. This parameter change simultaneously improves chemical resistance, heat resistance, electrical properties, and adhesion to metal substrates.
4Reliability
If high temperature heat treatment is applied for curing photosensitive resin, then curing is achieved, but thermal damage occurs to semiconductor device
Solution Approach 1:
The patent changes the curing parameters by using polyamide-imide resin that can be cured at lower temperatures compared to conventional photosensitive resins. This parameter change achieves sufficient curing efficiency while reducing thermal damage to semiconductor devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polyamide-imide resin composition enables high-efficiency curing at temperatures of 250°C or less, resulting in a cured film with superior mechanical properties and photosensitivity, addressing the limitations of existing resins by improving adhesion, chemical resistance, and heat stability.
Implementation Method 1
a photoacid generator, are provided
Implementation Method 2
a polymer compound which undergoes a chemical change in a molecular structure in a short time by light irradiation, causing changes in physical properties such as solubility, coloration, and curing
Data Source
AI summary
A photosensitive resin composition including a polyamide-imide resin having a specific structure, a film comprising a cured product of the photosensitive resin composition, a method for preparing the film and a method for forming a resist pattern using the photosensitive resin composition.