Polyamide-Metal Laminates with Cyclic Imide Tie Layer

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Solution Overview

Problem

Current methods for bonding lightweight metals like aluminum to polyamides for automotive components fail to provide sufficient adhesion and hydrolysis resistance, especially in high-temperature under-hood applications exposed to ethylene glycol solutions.

Innovation Solution

Development of polyamide-metal laminates using a tie layer comprising a polymer with carboxylic acid groups and an amino-silane, which forms a cyclic imide structure upon heating, enhancing the bond strength and hydrolysis resistance between the metal and polyamide layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional surface treatments are used to bond lightweight metals to polyamides, then adhesion is achieved, but hydrolysis resistance and bond strength are insufficient in high-temperature applications

Engineering Contradiction:
Improvehydrolysis resistanceVSAvoidbond strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent introduces a tie layer comprising a polymer with carboxylic acid groups and an amino-silane as an intermediary between the metal surface and polyamide. This tie layer forms a cyclic imide structure that acts as a chemical bridge, providing both strong adhesion to the metal and resistance to hydrolysis in high-temperature environments, thereby resolving the contradiction between bond strength and hydrolysis resistance

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention creates a composite structure consisting of metal substrate, tie layer with cyclic imide structure, and polyamide coating. This composite material system combines the advantages of each component: the metal provides structural support, the tie layer provides chemical bonding and hydrolysis resistance, and the polyamide provides environmental protection, achieving both high bond strength and excellent hydrolysis resistance

Inventive Principle:
Principle #40Composite materials

2Weight of moving object

If direct adhesion of aluminum to polyamide is attempted, then weight reduction is achieved, but adhesion fails under high-temperature ethylene glycol exposure

Engineering Contradiction:
Improvecomponent weightVSAvoidadhesion reliability
Core Design Contradiction:
Weight of moving objectVSReliability

Solution Approach 1:

The amino-silane in the tie layer serves as a mediator that chemically bonds to the aluminum surface through silane-metoxo groups while also forming imide structures with the carboxylic acid-containing polymer, creating a reliable adhesion interface that maintains bond strength under high-temperature ethylene glycol exposure while enabling direct attachment of lightweight aluminum to polyamide

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes the chemical parameters of the interface by introducing carboxylic acid groups and amino-silane that react to form cyclic imide structures. This chemical transformation creates bonds with sufficient strength and hydrolysis resistance to maintain adhesion reliability in high-temperature applications while using lightweight aluminum components

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The polyamide-metal laminates exhibit improved bond strength and hydrolysis resistance, maintaining over 7.1% retention after exposure to an ethylene glycol/water solution at 130°C for 1000 hours, outperforming conventional surface treatments.

Implementation Method 1

a tie layer comprising a polymer with carboxylic acid groups and an amino-silane, which forms a cyclic imide structure upon heating, enhancing the bond strength and hydrolysis resistance between the metal and polyamide layers

Methodology Applied
Scientific EffectCyclic imide structure formation: Chemical Bonding

Implementation Method 2

the polyamide-metal laminates exhibit improved bond strength and hydrolysis resistance, maintaining over 7.1% retention after exposure to an ethylene glycol/water solution at 130°C for 1000 hours

Methodology Applied
Scientific EffectHydrolysis resistance: Chemical Bonding

Data Source

PatentUS11826984B2Polyamide-metal laminates
Publication Date: 2023.11.28 CELANESE POLYMERS HLDG INC
  • US11826984B2 patent drawing
  • US11826984B2 patent drawing
  • US11826984B2 patent drawing

AI summary

Novel polyamide-metal laminates which have desirable hydrolysis resistance are provided. The laminates comprise (A) a metal, (B) a tie layer, and (C) a polyamide composition. The tie layer is formed from a composition containing (B1) a polymer containing a comonomer having at least two adjacent carboxylic acid groups and (B2) an amino-silane containing a primary amine and at least one hydroxyl group.