Aromatic Polyamide Particle Composition for Better Dispersibility

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Solution Overview

Problem

Existing particle compositions containing aromatic polyamides and/or aromatic polyamic acids face challenges with low solubility and high cohesion, leading to poor dispersibility and processability, which limits their application in high-performance materials such as fibers, films, and electronic components.

Innovation Solution

A particle composition with an aromatic polyamide and/or aromatic polyamic acid as major components, characterized by a specific ratio of average hydrodynamic radii (rA/rB) greater than 1, a BET surface area of 50 m2/g to 90 m2/g, and a molecular weight ratio (Mw/Mn) of 1.0 to 2.5, which enhances dispersibility and solubility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If aromatic polyamide and/or aromatic polyamic acid are used as major components, then mechanical properties and heat resistance are improved, but dispersibility and solubility deteriorate

Engineering Contradiction:
Improvemechanical properties and heat resistanceVSAvoiddispersibility and solubility
Core Design Contradiction:
StrengthVSEase of operation

Solution Approach 1:

The aromatic polyamide and/or aromatic polyamic acid are divided into fine particles with controlled size distribution (d50: 1-10 μm, d90: 20 μm or less). This segmentation into small particles improves dispersibility and solubility while maintaining the high mechanical properties and heat resistance of the aromatic polyamide base material.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The particle size parameters are precisely controlled (d50: 1-10 μm, d90: 20 μm or less) to optimize both dispersibility and mechanical properties. Additionally, the molecular weight ratio Mw/Mn is controlled within 1.0-2.5 to ensure uniform particle characteristics that enhance both processing ease and structural integrity.

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If conventional production methods are used, then processability is improved through solvent selection, but application to high rigidity aromatic polyamides is limited

Engineering Contradiction:
ImproveprocessabilityVSAvoidapplication range
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The particle composition formulation and production method are designed to be universally applicable to various aromatic polyamides and aromatic polyamic acids, including high rigidity types. The controlled particle size distribution (d50: 1-10 μm, d90: 20 μm or less) and molecular weight ratio (Mw/Mn: 1.0-2.5) create a versatile system that can be processed into diverse products such as fibers, films, and molded articles regardless of the specific aromatic polyamide type.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The improved particle composition achieves excellent handleability and solubility, enabling the production of high-performance materials with enhanced rigidity, heat resistance, and reduced impurities, suitable for applications in films, optical lenses, ion conductive membranes, and circuit boards.

Implementation Method 1

rA (nm) is an average hydrodynamic radius of particles as measured by a dynamic light scattering method in an aqueous dispersion containing said particle composition

Methodology Applied
Scientific EffectDynamic light scattering: Scattering

Implementation Method 2

rB is said average hydrodynamic radius after subjecting the aqueous dispersion to an ultrasonic treatment

Methodology Applied
Scientific EffectUltrasonic treatment: Ultrasonic Vibration

Data Source

PatentUS20250026888A1Particle composition, film, optical lens, diffractive optical element, ion conductive membrane, battery separator film, secondary battery, circuit board, and diaphragm
Publication Date: 2025.01.23 TORAY INDUSTRIES INC
  • US20250026888A1 patent drawing
  • US20250026888A1 patent drawing
  • US20250026888A1 patent drawing

AI summary

The present disclosure provides a resin composition containing an aromatic polyamide and/or an aromatic polyamic acid.