Polyamide Resin Composition for Plating Adhesion

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Solution Overview

Problem

Current polyamide resin compositions face challenges in achieving good plating adhesion, impact resistance, thermal resistance, fluidity, and appearance, with existing methods either compromising on impact resistance or thermal resistance when improving wettability.

Innovation Solution

A polyamide resin composition comprising 15-49 wt% aromatic polyamide resin, 1-30 wt% polyamide resin with a glass transition temperature of 40-120°C, 1-20 wt% olefin-based copolymer, and 30-50 wt% calcium carbonate, optimized to balance plating adhesion, thermal resistance, and appearance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an inorganic material or epoxy group-containing polyolefin is added to improve wettability, then plating adhesion is improved, but impact resistance deteriorates

Engineering Contradiction:

Improveplating adhesionVSAvoidimpact resistance

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent changes the chemical parameter by introducing carboxyl groups (COOH) on the polyolefin chain through reaction with dicarboxylic acid anhydride. This functional group modification improves plating adhesion without requiring inorganic materials or epoxy groups, thereby avoiding impact resistance deterioration while achieving the desired wettability enhancement

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses a simple organic modification approach (carboxyl group introduction) instead of complex inorganic material additions or epoxy-containing polymers. This simpler chemical modification achieves the same plating adhesion improvement with fewer side effects on mechanical properties

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

2Reliability

If a polyamide resin is alloyed with ABS resin or polycarbonate resin to improve wettability, then plating adhesion is improved, but thermal resistance deteriorates

Engineering Contradiction:

Improveplating adhesionVSAvoidthermal resistance

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent modifies the polyolefin with carboxyl groups through reaction with dicarboxylic acid anhydride, changing its chemical parameters to improve plating adhesion. This maintains the thermoplastic nature and thermal resistance of the polyamide resin while achieving the desired wettability, avoiding the need to alloy with ABS or polycarbonate

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite system where modified polyolefin (with carboxyl groups) is incorporated into the polyamide resin matrix. This composite approach improves plating adhesion through the functionalized polyolefin while maintaining the overall thermal resistance of the polyamide base material, avoiding deterioration from alloying with lower-temperature resins

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS11565513B2Polyamide resin composition and molded article comprising the same

Publication Date: 2023.01.31 LOTTE CHEM CORP

AI summary

A polyamide resin composition and a molded article manufactured using the same. The polyamide resin composition includes: about 15 wt % to about 49 wt % of an aromatic polyamide resin including a repeat unit represented by Formula 1 and a repeat unit represented by Formula 2 as defined in the specification; about 1 wt % to about 30 wt % of a polyamide resin having a glass transition temperature of about 40° C. to about 120° C.; about 1 wt % to about 20 wt % of an olefin-based copolymer; and about 30 wt % to about 50 wt % of calcium carbonate. The polyamide resin composition and the molded article produced using the same can have good properties in terms of plating adhesion, impact resistance, thermal resistance, fluidity, and/or appearance, and the like.