Polyamide-Polyamine Polishing Composition for Copper Trace Flatness
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Solution Overview
Problem
Conventional polishing compositions for semiconductor devices often result in unintended depressions on the sides of traces during chemical mechanical polishing, particularly when copper or copper alloys are used, as the conductor layer surface near the insulator layer boundary is corroded during the process.
Innovation Solution
A polishing composition containing a polyamide-polyamine polymer with an amine value of 150 mg KOH/1 g·solid or greater, along with a polishing accelerator, oxidizing agent, and metal anticorrosive agent, which forms a protective film on the conductor layer to prevent corrosion and depressions during the polishing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional polishing compositions are used for copper or copper alloy conductor layers, then the polishing process can be performed, but depressions are formed on the sides of traces due to corrosion of the conductor layer surface near the insulator layer boundary
Solution Approach 1:
The patent introduces a water-soluble polymer with high amine value as an intermediary substance that adsorbs onto the conductor layer surface, forming a protective film that mediates between the polishing composition and the copper surface. This protective film prevents direct corrosive interaction between the polishing composition and the conductor layer, thereby eliminating depression formation while maintaining polishing effectiveness.
Solution Approach 2:
The patent changes the chemical parameters of the polishing composition by specifying a water-soluble polymer with an amine value of 150 mg KOH/1 g·solid or greater. This parameter change (high amine value) fundamentally alters the protective capability of the polymer, enabling it to form a sufficiently robust protective film on the conductor layer surface to prevent corrosion-induced depressions.
2Productivity
If the conductor layer surface near the insulator layer boundary is exposed during polishing, then the polishing process can proceed, but the surface becomes corroded and depressions form
Solution Approach 1:
The water-soluble polymer performs preliminary protective action by adsorbing onto the conductor layer surface before the corrosive polishing action occurs. This pre-formed protective film ensures that when polishing proceeds, the conductor layer surface is already protected, preventing corrosion and maintaining surface integrity throughout the polishing process.
Solution Approach 2:
The protective film formed by the water-soluble polymer acts as an intermediary layer between the polishing composition and the conductor layer. This intermediary layer allows the polishing process to proceed at high productivity while simultaneously protecting the conductor layer surface integrity by preventing direct corrosive contact.
3Manufacturing precision
If a protective film is formed on the conductor layer to prevent corrosion, then depression formation is reduced, but the polishing composition complexity increases
Solution Approach 1:
Rather than adding multiple different protective agents, the patent achieves the protective function by changing the parameter (amine value) of a single water-soluble polymer component to 150 mg KOH/1 g·solid or greater. This parameter-based approach provides the necessary protective film while maintaining relative composition simplicity compared to multi-component systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively inhibits the formation of depressions on the sides of traces, improving the flatness and quality of the polished surface, especially when copper or copper alloys are used, by forming a robust protective film that reduces corrosion during the polishing process.
Implementation Method 1
the water-soluble polymer forms a protective film on the conductor layer to prevent corrosion
Implementation Method 2
a polishing composition containing a water-soluble polymer, a polishing accelerator, and an oxidizing agent
Implementation Method 3
chemical mechanical polishing
Data Source
AI summary
A polishing composition contains a water-soluble polymer, a polishing accelerator, and an oxidizing agent. The water-soluble polymer is a polyamide-polyamine polymer having an amine value of 150 mg KOH/1 g·solid or greater.