Polyamide Thermal Plastic Potting for Munitions Electronics

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Solution Overview

Problem

Current potting compounds used in munitions, such as epoxy, are expensive and non-reworkable, making it difficult and costly to diagnose and repair electronic components during testing phases, and they do not adequately protect against shock, vibration, corrosive materials, and extreme temperatures.

Innovation Solution

The use of polyamide thermal plastics as a potting material, which provides insulation and shielding for electronic components, allowing for reworkability and cost-effective production by being removable and capable of withstanding high forces and temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If epoxy potting compound is used, then protection against environmental stresses is improved, but cost increases and reworkability is lost

Engineering Contradiction:

Improveprotection against environmental stressesVSAvoidcost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces expensive epoxy potting compounds with inexpensive thermoplastic materials that can be easily removed and reapplied. The thermoplastic material serves as a cost-effective alternative that sacrifices the permanent bonding特性 of epoxy but gains reworkability and cost efficiency, allowing the potting compound to be discarded and replaced during rework operations.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent changes the material parameters from thermosetting epoxy to thermoplastic materials with specific melting points and flow characteristics. This parameter change enables the potting compound to transition between solid and molten states, providing protection during operation while allowing easy removal through heating during rework, thus resolving the contradiction between protection and reworkability.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If epoxy potting compound is used, then protection against environmental stresses is improved, but reworkability deteriorates

Engineering Contradiction:

Improveprotection against environmental stressesVSAvoidreworkability

Core Design Contradiction:

ReliabilityVSEase of repair

Solution Approach 1:

The patent introduces dynamic properties to the potting compound by using thermoplastic materials that change state with temperature. The material is solid and protective at operating temperatures but becomes molten and removable when heated during rework, providing adaptive behavior that resolves the contradiction between providing stable protection and enabling easy repair.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The patent utilizes phase transitions of thermoplastic materials between solid and molten states to achieve both protection and reworkability. The material remains solid and protective during normal operation but transitions to a molten state when heated, allowing easy removal and reapplication, thus eliminating the need to choose between protection and reworkability.

Inventive Principle:

Principle #36Phase transitions

3Ease of repair

If polyamide thermal plastic is used, then reworkability is improved, but manufacturing precision may worsen

Engineering Contradiction:

ImprovereworkabilityVSAvoidpositioning accuracy

Core Design Contradiction:

Ease of repairVSManufacturing precision

Solution Approach 1:

The patent incorporates positioning features and alignment mechanisms into the housing and electronic components before applying the thermoplastic material. These preliminary positioning actions ensure that when the thermoplastic is removed and reapplied during rework, the components return to their correct positions, thus maintaining manufacturing precision despite the reworkability of the material.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The polyamide thermal plastics effectively protect electronic components from environmental stresses and enable reworkability, reducing manufacturing costs and ensuring functionality under extreme conditions, such as up to 50,000 g forces during rail gun testing.

Implementation Method 1

the polyamide thermal plastics effectively protect electronic components from environmental stresses

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 2

capable of withstanding high forces and temperatures... up to 50,000 g forces during rail gun testing

Methodology Applied

Scientific EffectThermal resistance: Thermal Insulation

Data Source

PatentUS8640619B1Use of polyamide thermal plastics as low cost electronics potting compounds for munitions applications

Publication Date: 2014.02.04 ROCKWELL COLLINS INC

AI summary

The present invention is directed to use of a polyamide thermal plastic as a potting compound for potting electronic components (ex.—printed circuit boards) of an electronics assembly which is implemented in a munition. Use of the polyamide thermal plastic as a potting compound allows for a gun-hardened electronics assembly. Use of the polyamide thermal plastic as a potting compound also allows for reworkability. For example, during early testing phases of the electronics assembly, the potting material of the present disclosure may be removable (ex.—such as via a hot solvent bath) from the electronics assembly so that the electronics components may be: examined to determine the cause(s) for low yield during testing; and/or fixed, rather than having to rebuild the entire electronics assembly, thereby promoting lower costs of producing the electronics assembly.