Polyarylene Sulfide Resin Composition for High-Temperature Electronic Components
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Solution Overview
Problem
Polyarylene sulfide and aromatic polyamide resin compositions used in surface mount electronic components face challenges with low compatibility, leading to reduced mechanical strength and flame retardancy when exposed to high temperatures during the reflow process, resulting in blistering and inadequate heat resistance.
Innovation Solution
A resin composition with a polyarylene sulfide resin and an aromatic polyamide having terephthalic acid amide as an essential structural unit, blended in a specific ratio of 70/30 to 95/5 by mass, where the aromatic polyamide is micro-dispersed in the polyarylene sulfide resin, enhancing heat resistance and maintaining mechanical strength and flame retardancy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If polyarylene sulfide and aromatic polyamide are blended to improve heat resistance, then heat resistance is improved, but compatibility is poor leading to non-uniform mixing and reduced mechanical strength
Solution Approach 1:
The patent applies parameter changes by controlling the particle size of aromatic polyamide to 0.1-1.0 μm and optimizing the blending ratio (polyarylene sulfide 95-70 mass% and aromatic polyamide 5-30 mass%). These parameter adjustments enable uniform dispersion of the low-compatibility materials, achieving both high heat resistance (melting point above 280°C) and maintained mechanical strength after reflow heating.
2Temperature
If polyarylene sulfide and aromatic polyamide are blended to achieve high heat resistance, then heat resistance is improved, but flame retardancy deteriorates due to large quantity of aromatic polyamide
Solution Approach 1:
The patent optimizes the content ratio of aromatic polyamide to polyarylene sulfide, limiting aromatic polyamide to 5-30 mass% and polyarylene sulfide to 95-70 mass%. This parameter control ensures sufficient heat resistance while maintaining flame retardancy, as polyarylene sulfide provides excellent inherent flame resistance.
3Ease of manufacture
If conventional resin materials are used in surface mount components, then ease of manufacture is good, but the components melt or deform in the heating furnace due to lower melting point
Solution Approach 1:
The patent creates a composite material by blending polyarylene sulfide resin with aromatic polyamide particles (0.1-1.0 μm). This composite achieves a melting point above 280°C, suitable for lead-free soldering, while maintaining good moldability. The composite structure allows the material to withstand reflow furnace temperatures without melting or deforming.
Data Source
AI summary
To provide a heat-resistant resin composition which has excellent heat resistance, does not show a reduced mechanical strength such as flexural strength even after being passed rough a reflow furnace and heat-treated under high temperature conditions, and also has an excellent flame retardancy; a production method of the heat-resistant resin composition; a heat-resistant resin-molded article; and a surface mount electronic component. The heat-resistant resin composition includes a polyarylene sulfide resin (A) and an aromatic polyamide (B) having terephthalic acid amide as an essential structural unit at a former/latter ratio of 70/30 to 95/5 by mass. In a molded article composed of the heat-resistant resin composition, the average diameter of holes formed by etching a broken-out section of the molded article with an organic solvent is 0.1 to 1.0 μm, where the broken-out section is observed on a scanning electron microscope (2,500 times).