Polyarylene Sulfide Resin Composition for Reflow Heat Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Polyarylene sulfide resin compositions that combine with aromatic polyamide often experience mechanical property degradation and blistering during high-temperature reflow processes due to decomposition, leading to reduced bending strength and poor flame retardance in surface mount electronic components.
Innovation Solution
Incorporating aromatic phosphite or phosphonate compounds and metal salts of phosphorous acid or hypophosphoric acid into the polyarylene sulfide and aromatic polyamide resin composition, along with specific processing conditions in a double-screw kneading extruder, to inhibit gas generation and enhance mechanical strength and heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If polyarylene sulfide and aromatic polyamide are mixed to create a high heat resisting material, then heat resistance is improved, but polyamide is decomposed by polyarylene sulfide causing gas generation and blistering
Solution Approach 1:
The patent introduces a silane coupling agent as an intermediary substance between polyarylene sulfide and aromatic polyamide. This coupling agent prevents direct decomposition reactions while maintaining the heat resistance benefits of the polyamide component during reflow soldering processes
Solution Approach 2:
The patent extracts and removes the harmful decomposition reaction between polyarylene sulfide and aromatic polyamide by introducing a silane coupling agent that prevents the decomposition, thereby eliminating gas generation and blistering while preserving the heat-resistant properties
2Temperature
If polyarylene sulfide and aromatic polyamide are mixed to create a high heat resisting material, then heat resistance is improved, but mechanical properties such as bending strength decrease after reflow furnace treatment
Solution Approach 1:
The silane coupling agent acts as a mediator that maintains mechanical property integrity by preventing decomposition reactions, thereby preserving bending strength and other mechanical properties after exposure to reflow furnace temperatures
Solution Approach 2:
The patent creates a composite material system where polyarylene sulfide, aromatic polyamide, and silane coupling agent work together synergistically. The coupling agent enhances the interfacial bonding between components, maintaining mechanical strength while achieving high heat resistance
3Object-affected harmful factors
If lead-free solder with higher melting point is used for environmental reasons, then environmental contamination is reduced, but reflow furnace temperature must be increased causing resin component fusion or deformation
Solution Approach 1:
The patent changes the thermal stability parameter of the resin composition by incorporating aromatic polyamide and silane coupling agent, enabling the material to withstand the higher temperatures required for lead-free soldering without fusion or deformation
Solution Approach 2:
The silane coupling agent mediates the thermal stress and prevents decomposition at elevated temperatures, allowing the use of lead-free solder with higher melting points while protecting the resin-based electronic component from thermal damage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting polyarylene sulfide resin composition maintains excellent mechanical properties and flame retardance even after high-temperature reflow, making it suitable for surface mount electronic components without blistering or deformation.
Implementation Method 1
a resin composition, wherein a silane coupling agent (E) is compounded to a resin composition which includes polyarylene sulfide (A) and aromatic polyamide (B)
Implementation Method 2
a production method of a polyarylene sulfide resin composition, wherein melt-kneading of the resin composition is performed under conditions that a ratio (discharge volume / screw rotation frequency) of discharge volume (kg/hr) to screw rotation frequency (rpm) is 0.02 to 0.2 (kg/hr·rpm)
Implementation Method 3
there is a problem that it is necessary to further increase the temperature of a heating furnace (reflow furnace) when surface molding is performed
Data Source
AI summary
The present invention relates to a polyarylene sulfide resin composition, which comprises polyarylene sulfide (A) and polyamide (B) as essential components, and further includes an organic phosphorus compound (C), which is selected from the group consisting of an aromatic phosfite compound and an aromatic phosphonaite compound, and an inorganic phosphorus compound (D), which is selected from the group consisting from a metal salt of phosphorous acid and a metal salt of hypophosphoric acid as essential components, in addition to the polyarylene sulfide (A) and the polyamide (B); a manufacturing method thereof; and a surface mount electronic component. The polyarylene sulfide resin composition has excellent heat resistance, does not decrease mechanical properties such as bending strength even if heating treatment is performed under the high temperature condition by passing through a reflow furnace, and has excellent flame retardance.