Polyazomethine Temporary Bonding Layer for Laser Debonding
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Solution Overview
Problem
Current temporary bonding/debonding processes in microelectronic wafer handling require multiple layers and complex coating and baking steps, leading to increased costs and decreased throughput, whereas a single material capable of functioning as both a temporary bonding layer and a laser release layer could significantly reduce these issues.
Innovation Solution
A polyazomethine-based composition is used as both a bonding layer and a laser release layer, comprising recurring monomers of dialdehyde, aromatic diamine, and aliphatic diamine, which is exposed to laser energy to facilitate separation of substrates, eliminating the need for multiple layers and simplifying the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple layers (bonding layer and releasing layer) are used for temporary bonding, then the bonding and release functions are achieved, but the process complexity and cost increase
Solution Approach 1:
The patent combines the bonding layer and releasing layer into a single integrated layer. This layer contains both the temporary bonding functionality and the laser-induced release functionality, eliminating the need for separate coating and baking steps for each layer, thus reducing process complexity while maintaining both bonding and release functions
Solution Approach 2:
The single layer is designed to perform multiple functions: it provides temporary bonding between substrates during processing and simultaneously serves as the releasing layer that can be decomposed by laser irradiation to enable substrate separation. This multi-functional design eliminates the need for multiple specialized layers
2Reliability
If multiple layers are used for temporary bonding, then bonding and release are achieved, but the manufacturing cost increases
Solution Approach 1:
By merging the bonding layer and releasing layer into one integrated layer, the patent reduces the number of coating and baking steps required, directly reducing manufacturing costs while maintaining both bonding and release functions
Solution Approach 2:
The multi-functional single layer eliminates the need for multiple material purchases, storage, and handling operations, thereby reducing overall manufacturing costs while achieving both bonding and release capabilities
3Reliability
If multiple layers are used for temporary bonding, then bonding and release are achieved, but the processing time increases
Solution Approach 1:
The patent merges the bonding layer and releasing layer into a single layer, reducing the number of sequential coating and baking steps. This integration directly decreases processing time and increases throughput while maintaining both bonding and release functions
Solution Approach 2:
The single multi-functional layer eliminates the need for sequential processing of multiple layers, thereby reducing total processing time and improving manufacturing throughput while achieving both bonding and release capabilities
4Device complexity
If a single material is used for both bonding and release, then process complexity and cost are reduced, but the material must perform dual functions
Solution Approach 1:
The patent designs a single material that inherently possesses both temporary bonding capability and laser-induced decomposability. This multi-functional material eliminates the need for multiple specialized layers and simplifies the overall process while maintaining both bonding and release functions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient and cost-effective temporary bonding and debonding with reduced mechanical stress and processing complexity, improving throughput and reducing the overall cost of ownership by using a single material for both functions.
Implementation Method 1
The bonding layer is exposed to laser energy so as to facilitate separation of the first and second substrates
Data Source
AI summary
The materials and methods disclosed can be used for applications such as temporary bond and debond of semiconductor and display substrates. These materials have sufficiently low melt rheologies to be used as a bonding layer and can crosslink/cure to allow for reduction in material flow over long periods of time. This class of materials also incorporates the ability to be used as a single-layer system for debonding purposes and typically uses laser debonding for its release mechanism. These materials also allow for solvent cleanability using very mild acidic conditions instead of the typical harsh conditions used on curable layers.