Polybutadiene Adhesive Resin for Foldable Display Reliability
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Solution Overview
Problem
Existing adhesive members in display devices face challenges in maintaining stable coupling, impact resistance, adhesion reliability, and light fastness, which can degrade display quality over time.
Innovation Solution
A resin composition comprising polybutadiene with unsaturated bonds, a photoinitiator, and (meth)acrylate monomers, excluding urethane (meth)acrylate-terminated polybutadiene, is used to create an adhesive member with low viscosity and high tensile modulus, ensuring strong adhesion and resistance to discoloration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional adhesive members are used in display devices, then initial bonding is achieved, but adhesion reliability and light fastness degrade over time
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive by specifying polybutadiene content (1-10 wt%), photoinitiator concentration, and monomer ratios to achieve optimal long-term adhesion and light fastness properties
Solution Approach 2:
The invention creates a composite adhesive system combining polybutadiene, photoinitiators, and (meth)acrylate monomers/oligomers that work synergistically to provide both initial bonding strength and long-term reliability
2Stability of the object's composition
If adhesive member provides strong coupling, then component stability is improved, but impact resistance decreases
Solution Approach 1:
The patent optimizes the balance between coupling strength and impact resistance by controlling the molecular weight distribution and composition ratios of the adhesive materials
Solution Approach 2:
The adhesive composition provides dynamic mechanical properties that allow the material to transition from rigid (for stable coupling) to flexible (for impact absorption) states
3Strength
If adhesive member ensures high adhesion strength, then component coupling is improved, but light fastness deteriorates
Solution Approach 1:
The patent converts the potentially harmful effect of UV light on adhesive degradation into a beneficial curing mechanism by incorporating photoinitiators that activate only during the curing process, leaving the finished adhesive resistant to light-induced degradation
Solution Approach 2:
The invention modifies the chemical structure parameters by selecting specific monomers and oligomers with low light absorption coefficients to achieve both strong adhesion and excellent light fastness
4Strength
If resin composition has high viscosity, then adhesion strength is improved, but ease of application deteriorates
Solution Approach 1:
The patent controls the viscosity parameter through careful selection of oligomer molecular weights and concentrations to achieve optimal flow characteristics for inkjet printing while maintaining adequate adhesion strength
Solution Approach 2:
The adhesive composition exhibits dynamic viscosity that allows easy application through inkjet printing at low viscosity, then builds adhesion strength through chemical curing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive member exhibits excellent impact resistance, adhesion reliability, and light fastness, maintaining display quality and enabling repeated folding and unfolding of flexible display devices.
Implementation Method 1
at least one photoinitiator
Data Source
AI summary
A resin composition is disclosed. The resin composition may include a polybutadiene having an unsaturated bond in at least one selected from among a main chain and a side chain, at least one photoinitiator, at least one monofunctional (meth)acrylate monomer, and/or at least one (meth)acrylate oligomer. The resin composition may not include a urethane (meth)acrylate-terminated polybutadiene. An amount of the polybutadiene may be about 1 wt % or more and less than about 10 wt % based on a total of 100 wt % of the resin composition. The resin composition may have a shear viscosity of about 8 mPa·s to about 50 mPa·s as measured at a temperature of about 25° C. The resin composition may have a tensile modulus of about 10 MPa to about 900 MPa at a temperature of about 25° C. after photocuring.


