Polycarbodiimide Curing Agent Low-Temperature Dissociation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing modified polycarbodiimide compounds derived from diisocyanate compounds with diisopropylamine have high dissociation temperatures, leading to incomplete dissociation and reduced adhesiveness and heat resistance, as well as insufficient curing of resin compositions.
Innovation Solution
Modifying polycarbodiimide compounds with aromatic heterocyclic compounds having endocyclic secondary amine nitrogen, such as pyrazole and imidazole derivatives, to lower the dissociation starting temperature and enhance reactivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If diisopropylamine is used to modify polycarbodiimide compound, then storage stability is improved, but dissociation temperature becomes too high causing incomplete dissociation and reduced adhesiveness
Solution Approach 1:
The patent changes the chemical structure parameter of the amine component from diisopropylamine to aromatic heterocyclic compounds (pyrazole or imidazole derivatives). This structural parameter change results in modified carbodiimide compounds that dissociate at lower temperatures (80-150°C) while maintaining storage stability, thereby resolving the contradiction between storage stability and dissociation temperature.
2Stability of the object's composition
If diisopropylamine-modified polycarbodiimide is used, then storage stability is improved, but adhesiveness deteriorates due to incomplete dissociation
Solution Approach 1:
The patent modifies the chemical structure parameter by replacing diisopropylamine with aromatic heterocyclic compounds. This change enables complete dissociation at lower temperatures, ensuring sufficient carbodiimide group regeneration for strong adhesion while maintaining storage stability. The structural parameter change directly addresses the contradiction between storage stability and adhesiveness.
3Stability of the object's composition
If diisopropylamine-modified polycarbodiimide is used, then storage stability is improved, but curing efficiency deteriorates
Solution Approach 1:
The patent changes the chemical structure parameter from diisopropylamine to aromatic heterocyclic compounds, which enables the modified carbodiimide to dissociate completely at lower temperatures. This ensures sufficient carbodiimide group regeneration for efficient crosslinking reactions with carboxyl groups in resin compositions, thereby improving curing efficiency while maintaining storage stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modified polycarbodiimide compounds exhibit improved low-temperature amine dissociation, increased adhesiveness, and efficient curing of resin compositions, resulting in enhanced storage stability and heat resistance.
Implementation Method 1
The modified carbodiimide compound, when cast and then dried, re-produces a carbodiimide group by amine dissociation, thereby exhibiting more excellent adhesiveness or the like.
Implementation Method 2
the carbodiimide group allows a resin composition to be cured
Data Source
AI summary
The modified polycarbodiimide compound of the present invention is obtained by modifying a polycarbodiimide compound derived from a diisocyanate compound with an aromatic heterocyclic compound having endocyclic secondary amine nitrogen. The curing agent of the present invention comprises the modified polycarbodiimide compound of the present invention. Thus, a modified polycarbodiimide compound that allows amine dissociation to start at a low temperature as compared with a modified polycarbodiimide compound obtained by modifying a polycarbodiimide compound derived from a diisocyanate compound with diisopropylamine, and a curing agent comprising the modified polycarbodiimide compound can be provided.