Polycrystalline Carrier Substrate Structure to Prevent SAW Chipping
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Inadequate mechanical strength of carrier substrates in SAW devices leads to chipping during manufacturing, reducing production yield and quality, and increasing costs.
Innovation Solution
A carrier substrate formed of polycrystalline material with a grain density of ≥1000 grains/mm² and a grain boundary volume ratio of 8% to 40% is used, along with a method involving polishing and sandblasting to achieve enhanced flexural strength, preventing chipping during bonding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the carrier substrate is made thinner to improve heat dissipation, then heat dissipation performance is improved, but mechanical strength is reduced causing chipping during manufacturing
Solution Approach 1:
The patent changes the microstructural parameters of the carrier substrate by controlling grain density (≥1000 grains/mm²) and grain boundary volume ratio (8%-40%). This allows the substrate to be made thinner while maintaining sufficient mechanical strength to prevent chipping during manufacturing, thereby enabling improved heat dissipation without sacrificing structural integrity
Solution Approach 2:
The patent uses polycrystalline materials with specifically engineered grain structures as the carrier substrate. The composite microstructure with controlled grain size and grain boundary distribution provides both the mechanical strength needed for thin substrates and the thermal properties for effective heat dissipation
2Manufacturing precision
If the carrier substrate strength is increased to prevent chipping, then manufacturing quality is improved, but substrate thickness must be increased reducing heat dissipation
Solution Approach 1:
Instead of increasing thickness to improve strength, the patent changes the microstructural parameters (grain density and grain boundary volume ratio) to achieve high mechanical strength in thin substrates. This resolves the contradiction by maintaining production quality through microstructural control rather than geometric modification
3Strength
If grain density is increased to enhance strength, then mechanical strength is improved, but manufacturing complexity increases
Solution Approach 1:
The patent achieves enhanced flexural strength by controlling the grain density parameter (≥1000 grains/mm²) and grain boundary volume ratio (8%-40%) during the sintering process. These are material science parameters that can be controlled through established ceramic processing techniques, avoiding excessive manufacturing complexity while achieving the desired mechanical properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate provides high mechanical strength, ensuring production quality and efficiency by preventing chipping and enabling thinner substrates for improved heat dissipation and noise suppression.
Implementation Method 1
the carrier substrate has a grain density of greater than or equal to 1000 grains/mm2, and a grain boundary volume ratio of 8% to 40%
Data Source
AI summary
The present invention discloses a substrate, an electronic device, and a module. The substrate provided by embodiments comprises a carrier substrate formed of a polycrystalline material, wherein the carrier substrate has a grain density greater than or equal to 1000 grains/mm2; and a grain boundary volume fraction ranging from 8% to 40%. The disclosed carrier substrate having such a specific grain density achieves high mechanical strength, which reduces the likelihood of chipping due to insufficient strength, thereby ensuring production quality and efficiency.