Polycycloolefin Planarization Layer for Organic Electronics
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Solution Overview
Problem
Current planarization materials for organic electronic devices, such as OFETs and OPVs, face issues like low surface energy causing de-wetting of OSC materials, high water permeation, and incompatibility with advanced OSC materials like Lisicon®, leading to poor electrical stability and performance.
Innovation Solution
The use of polycycloolefinic polymers, specifically norbornene-type polymers, as planarization layers that provide improved adhesion, reduced surface roughness, and enhanced OSC performance by modifying the surface energy and structural integrity, allowing for better compatibility with advanced OSC materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional planarization materials (acrylic, melamine, urethane polymers) are used, then planarization function is provided, but surface energy is low causing de-wetting of OSC materials
Solution Approach 1:
The patent applies parameter changes by modifying the chemical composition and surface properties of the planarization layer. Specifically, it uses polymers with controlled hydroxyl group content (0.1-10 mmol/g) and specific functional groups to adjust surface energy parameters, enabling proper wetting of OSC materials while maintaining planarization functionality. The invention changes the chemical parameters of the planarization layer to resolve the de-wetting issue.
2Reliability
If conventional polymer planarization materials are used, then planarization is achieved, but water permeation is high requiring additional barrier layers
Solution Approach 1:
The patent employs composite materials by combining multiple polymer components with specific functional groups (hydroxyl, carboxyl, amine, etc.) in a single planarization layer. This composite approach creates a material that simultaneously provides planarization and acts as a water barrier, eliminating the need for separate barrier layers. The composite polymer structure integrates multiple functions into one layer.
3Manufacturing precision
If planarization layers are applied to improve substrate surface, then additional layers are needed for surface modification and barrier functions
Solution Approach 1:
The patent implements universality by designing a planarization layer that performs multiple functions simultaneously: planarization, water barrier, adhesion promoter, and surface energy modification. This multi-functional approach eliminates the need for separate layers for each function, reducing device complexity while maintaining manufacturing precision and surface quality.
4Reliability
If existing planarization materials are used with advanced OSC materials like Lisicon®, then compatibility issues arise leading to poor electrical stability
Solution Approach 1:
The patent applies parameter changes by carefully controlling the chemical composition parameters of the planarization layer, including hydroxyl group content (0.1-10 mmol/g), molecular weight, and functional group types. These parameter adjustments create optimal chemical compatibility with advanced OSC materials like Lisicon®, ensuring good electrical stability without requiring additional interfacial modification layers.
Data Source
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AI summary
The invention relates to organic electronic devices comprising polycycloolefin planarization layers, and more particularly to planarization layers positioned between the substrate and a functional layer e.g. a semiconducting layer, a dielectric layer or an electrode, and further to the use of such a planarization layer in organic electronic devices, and to processes for preparing such polycycloolefin planarization layers and organic electronic devices.