Polyester Resin Adhesion Stability at High Temperatures

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing polyester resins for thermal bonding fibers face issues with low melting points leading to increased melt viscosity at high temperatures, causing fiber cross-sectional nonuniformity, poor processability, and reduced adhesive strength during spinning and thermal bonding processes.

Innovation Solution

A polyester resin formulation incorporating terephthalic acid or its ester-forming derivative, 2-methyl-1,3-propanediol, and 2-methyl-1,3-pentanediol as diol components, maintaining a controlled melt viscosity between 220°C and 260°C, ensuring stable adhesive strength and improved spinning processability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a low melting point polyester resin is used to enable thermal bonding at lower temperatures, then the processing temperature is reduced, but the adhesive strength and shape stability deteriorate at high temperatures

Engineering Contradiction:
Improvethermal bonding temperatureVSAvoidadhesive strength
Core Design Contradiction:
TemperatureVSStrength

Solution Approach 1:

The patent applies parameter changes by precisely controlling the melt viscosity of polyester resin within 500-2000 poises at 260°C and maintaining melt viscosity difference within 600 poises between 220°C and 260°C. This controlled viscosity parameter range enables the resin to maintain adequate adhesive strength at bonding temperatures while preventing excessive flow that would cause cross-sectional nonuniformity, thus resolving the contradiction between low bonding temperature and high temperature stability

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite materials by formulating a specific blend of polyester resins with different molecular weights and viscosity characteristics. The composite resin system combines components that provide low-temperature bondability with others that maintain high-temperature stability, achieving both low thermal bonding temperature requirements and adequate adhesive strength through synergistic material composition

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If the melt viscosity of polyester resin is reduced to improve flowability during spinning, then the spinning processability is improved, but the adhesive strength at high temperatures is compromised

Engineering Contradiction:
Improvespinning processabilityVSAvoidadhesive strength
Core Design Contradiction:
Ease of manufactureVSStrength

Solution Approach 1:

The patent resolves this contradiction through parameter changes by establishing specific melt viscosity ranges at different temperatures: 500-2000 poises at 260°C for adequate flow during spinning, while controlling the viscosity difference to within 600 poises between 220°C and 260°C. This controlled viscosity profile ensures good spinning processability while maintaining sufficient adhesive strength at operational temperatures

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent applies dynamics by creating a temperature-dependent viscosity profile where the resin exhibits appropriate flow characteristics at spinning temperatures and maintains structural integrity at bonding temperatures. The dynamic viscosity adjustment with temperature allows the material to be processable during spinning while maintaining strength during thermal bonding and service

Inventive Principle:
Principle #15Dynamics

3Strength

If the thermal bonding temperature is increased to improve adhesive strength, then the bonding strength is enhanced, but the melt viscosity increases causing fiber cross-sectional nonuniformity and poor processability

Engineering Contradiction:
Improveadhesive strengthVSAvoidfiber cross-sectional uniformity
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The patent applies parameter changes by inverting the conventional approach: instead of increasing temperature to improve strength, it controls the viscosity-temperature relationship to maintain adequate strength at lower temperatures. By limiting melt viscosity to 500-2000 poises at 260°C and the viscosity difference between 220°C and 260°C to 600 poises or less, the resin achieves good adhesive strength without the excessive viscosity that causes cross-sectional nonuniformity and processing defects

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The resin maintains high adhesive strength and improved spinning processability by preventing rapid drop in melt viscosity at high temperatures, reducing cross-sectional nonuniformity and enhancing the uniformity and durability of polyester fibers.

Implementation Method 1

the binder has a melt viscosity difference between 220°C and 260°C of 600 poises or less, and a melt viscosity at 260°C of 600 to 1,500 poises

Methodology Applied
Scientific EffectViscosity stabilization:

Implementation Method 2

a final melting point range of 145 to 180°C

Methodology Applied
Scientific EffectMelting: Melting

Data Source

PatentEP3889203B1Polyester resin having improved adhesion strength for binder and polyester fiber using same
Publication Date: 2024.08.28 HUVIS CORP
  • EP3889203B1 patent drawing

AI summary

The present invention relates to a polyester resin for an adhesive strength-improved binder and a polyester fiber using the same, in which adhesive properties of the polyester resin for the adhesive strength-improved binder are not lowered at high temperatures since melt viscosity even at high temperatures of the polyester resin for the adhesive strength-improved binder, as a polyester resin for a binder, the polyester resin including terephthalic acid or an ester-forming derivative thereof as an acid component and including 2-methyl-1,3-propanediol, 2-methyl-1,3-pentanediol, and ethylene glycol as diol components, is not greatly lowered.