Water-Soluble Polyester Resin for Semiconductor Plasma Dicing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for fabricating semiconductor device chips using plasma dicing face challenges with protective coatings that become altered by laser ablation and plasma exposure, leading to reduced water solubility and decreased manufacturing efficiency due to prolonged removal times.
Innovation Solution
A method involving a protective composition with a water-soluble polyester resin containing a polyvalent carboxylic acid residue and a polyvalent alcohol residue, specifically with a metal sulfonate group and naphthalene dicarboxylic acid residue, which forms a protective coating that can be easily applied, exposed to laser or plasma, and subsequently removed with an aqueous cleaning fluid, maintaining solubility and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective coating is applied to protect the substrate during laser ablation and plasma dicing, then the substrate and semiconductor device chips are protected, but the protective coating undergoes alteration and its water solubility declines, requiring longer removal time
Solution Approach 1:
The patent applies parameter changes by carefully controlling the molecular structure of the polyester resin, specifically the ratio of carboxylic acid residues to alcohol residues (1:2 to 1:10) and the degree of polymerization (5 to 100). These parameter optimizations ensure the coating maintains adequate protection during laser ablation and plasma dicing while preserving water solubility for quick removal.
Solution Approach 2:
The patent uses composite materials by combining polyester resin with specific additives including metal sulfonate compounds and naphthalene dicarboxylic acid residues. This composite structure provides both the protective function needed during processing and the water solubility required for easy removal, resolving the contradiction between durability and removability.
2Reliability
If the protective coating is made more durable to withstand laser ablation and plasma exposure, then protection effectiveness improves, but water solubility decreases, reducing manufacturing efficiency
Solution Approach 1:
The patent optimizes the chemical composition parameters of the polyester resin, specifically controlling the carboxylic acid to alcohol residue ratio (1:2 to 1:10) and degree of polymerization (5 to 100). These parameter adjustments create a balance where the coating has sufficient durability to withstand laser ablation and plasma exposure while maintaining water solubility for rapid removal, thus preserving manufacturing efficiency.
Solution Approach 2:
The patent applies local quality by creating a coating with differentiated properties: the polyester resin structure provides durability and plasma resistance where needed, while the incorporated metal sulfonate groups and carboxylic acid residues provide water solubility in specific regions. This localized functional distribution allows the coating to simultaneously achieve both protection and easy removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protective composition effectively protects semiconductor device chips during laser ablation and plasma dicing, ensuring easy removal and enhancing manufacturing efficiency by maintaining water solubility and plasma resistance.
Implementation Method 1
irradiating the protective coating with a laser beam to subject the wafer to laser ablation
Implementation Method 2
plasma dicing is one of techniques for fabricating a plurality of semiconductor device chips by dicing a substrate
Data Source
AI summary
A protective composition contains a water-soluble polyester resin including a polyvalent carboxylic acid residue and a polyvalent alcohol residue. The polyvalent carboxylic acid residue includes: a polyvalent carboxylic acid residue having a metal sulfonate group; and a naphthalene dicarboxylic acid residue. The proportion of the polyvalent carboxylic acid residue to the polyvalent carboxylic acid residue falls within the range from 25 mol % to 70 mol %. The proportion of the naphthalene dicarboxylic acid residue to the polyvalent carboxylic acid residue falls within the range from 30 mol % to 75 mol %.