Liquid Discharge Head with Polyether Amide Flow Channel
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Inkjet image recording systems face challenges with high-boiling point solvents in inks causing deformation of flow channel forming members, leading to peeling and unreliable ink discharge performance.
Innovation Solution
A liquid discharge head design featuring a flow channel forming member made from polyether amide, polyether imide, or polyether amide-imide resins with a thicker structure than the discharge port forming member, and a photosensitive resin composition for the discharge port, which prevents ink permeation and enhances reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a flow channel forming member is made from conventional organic material layers, then it can be formed by photolithography with high precision, but it deforms when exposed to high-boiling point solvents in inks
Solution Approach 1:
The patent changes the material parameter of the flow channel forming member from conventional organic materials to polyether amide resin, which has superior chemical stability and resistance to high-boiling point solvents while maintaining manufacturability through photolithography processes
Solution Approach 2:
The patent uses composite material structure where the flow channel forming member is made of polyether amide resin that combines the benefits of photolithographic formability with excellent solvent resistance, creating a material that satisfies both manufacturing precision and compositional stability requirements
2Object-affected harmful factors
If the flow channel forming member is made thinner to reduce solvent exposure, then solvent permeation decreases, but structural strength and reliability are compromised
Solution Approach 1:
The patent changes the material property parameter by selecting polyether amide resin with inherently low solvent permeability, allowing the flow channel forming member to maintain both adequate thickness for structural strength and low solvent permeation resistance
3Reliability
If a protective layer is added to prevent ink permeation, then ink discharge reliability improves, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent changes the material parameter of the flow channel forming member to polyether amide resin, which provides built-in resistance to high-boiling point solvents, thereby achieving reliable ink discharge performance without requiring additional protective layers or complex multi-layer structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses peeling of the flow channel forming member from the substrate and ensures high reliability by preventing ink permeation, even with highly permeable inks, maintaining stable ink discharge performance over time.
Implementation Method 1
the discharge port forming member is a cured product of a photosensitive resin composition
Data Source
AI summary
A liquid discharge head is provided which has a substrate, a flow channel forming member provided on a substrate surface of the substrate and forming a flow channel of a liquid, and a discharge port forming member provided on the flow channel forming member and having a discharge port through which a liquid is discharged, wherein the discharge port forming member and the flow channel forming member are formed of materials different from each other, a thickness of the flow channel forming member is greater than a thickness of the discharge port forming member in a direction perpendicular to the substrate surface, the discharge port forming member is a cured product of a photosensitive resin composition, and the flow channel forming member contains at least one resin selected from the group consisting of a polyether amide resin, a polyether imide resin and a polyether amide-imide resin.


