Polyether Polycarbonate Adhesive for Resin Bonding Without Primers
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Solution Overview
Problem
Existing adhesive compositions for bonding resin materials to other substrates, such as glass, often require the use of primers containing solvents, which can be environmentally harmful and lack sufficient adhesiveness without the use of primers.
Innovation Solution
Development of an adhesive composition featuring a polyether polycarbonate diol with a specific molecular weight range and no reactive silicon group, or a polyether polycarbonate polymer with a reactive silicon group, which enhances adhesiveness to resin materials without the need for primers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a primer containing solvent is used to bond resin material to glass, then adhesiveness is achieved, but environmental harm increases due to solvent content
Solution Approach 1:
The invention extracts and eliminates the harmful solvent component from the adhesive system while maintaining bonding functionality through a solvent-free polyether polycarbonate diol-based composition that achieves adhesiveness without environmental harm
Solution Approach 2:
The invention changes the chemical composition parameters by using polyether polycarbonate diol with specific molecular weight (500-10000) and controlled carbonate group content (5% or more) to achieve effective bonding without requiring harmful solvents
2Reliability
If flame treatment is applied to resin material before bonding, then adhesiveness to glass is improved, but processing complexity increases
Solution Approach 1:
The invention extracts the flame treatment step from the bonding process and replaces it with a solvent-free adhesive composition that achieves similar or superior adhesiveness without the complexity of thermal processing
Solution Approach 2:
The invention substitutes the thermal-mechanical flame treatment process with a chemical bonding approach using polyether polycarbonate diol that forms strong bonds through chemical compatibility rather than thermal modification
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed adhesive composition demonstrates improved adhesiveness to resin materials, reducing the environmental impact by eliminating the need for solvent-based primers and ensuring strong bonding performance.
Implementation Method 1
an adhesive composition including a polyether polycarbonate diol that has a number average molecular weight of 500 to 10000, and has no reactive silicon group represented by formula (1), or a polyether polycarbonate polymer (A) having the reactive silicon group represented by formula (1)
Data Source
Figure 1
AI summary
The present invention provides an adhesive composition excellent in adhesiveness to resin materials, and an article containing a cured product of the adhesive composition. The adhesive composition of the present invention includes a polyether polycarbonate diol that has a number average molecular weight of 500 to 10000, and has no specific reactive silicon group, or a polyether polycarbonate polymer (A) having the specific reactive silicon group.