Polyether-Modified Siloxane Adhesive for Peelable Wafer Bonding
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Solution Overview
Problem
Existing adhesives for bonding semiconductor wafers to supports during polishing fail to provide adequate spin coatability, heat resistance, and easy peelability, leading to potential deformation or detachment of wafers during processing.
Innovation Solution
An adhesive comprising a component that cures through a hydrosilylation reaction, containing polysiloxane and a platinum group metal-based catalyst, along with a polyether-modified siloxane, which allows for strong bonding during processing and easy peelability after polishing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional adhesives are used for bonding semiconductor wafers to supports during polishing, then the adhesive bond force can be sufficient to withstand polishing stress, but the adhesive lacks easy peelability after polishing causing wafer deformation or detachment
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive by incorporating polyether-modified siloxane with specific molecular weight ranges (1,000-10,000) and controlling the ratio of crosslinking agents. This parameter optimization enables the adhesive to achieve both sufficient bonding strength during polishing and easy peelability after processing, resolving the contradiction between bond stability and peelability.
Solution Approach 2:
The patent creates a composite adhesive system combining polyether-modified siloxane base resin with specific crosslinking agents (alcohol, carboxylic acid, or amine) in controlled ratios. This composite formulation provides dual functionality: strong adhesion during polishing through crosslinking and easy removal after polishing through the polyether modification, thus resolving the contradiction between bonding reliability and peelability.
2Strength
If strong adhesive bond force is used to prevent wafer detachment during polishing, then polishing stress resistance is improved, but wafer removal becomes difficult causing cutting or deformation
Solution Approach 1:
The patent optimizes the molecular weight parameter of the polyether-modified siloxane (1,000-10,000) and controls the crosslinking agent ratio to achieve balanced adhesive properties. This parameter tuning allows the adhesive to provide strong bond force during polishing while maintaining easy removability after processing, resolving the contradiction between strength and ease of operation.
Solution Approach 2:
The patent creates a dynamic adhesive system where the polyether-modified siloxane provides reversible bonding characteristics. The adhesive dynamically adapts its bond strength: maintaining strong adhesion during polishing operations and enabling easy release after processing, thus resolving the contradiction between strong bonding and easy removal.
3Ease of manufacture
If polyether-modified siloxane with low molecular weight is used to improve spin coatability, then coating quality is improved, but heat resistance during processing deteriorates
Solution Approach 1:
The patent precisely controls the molecular weight parameter of polyether-modified siloxane within the range of 1,000-10,000 and optimizes the crosslinking agent ratio. This parameter optimization achieves a balance where the adhesive maintains good spin coatability while developing sufficient heat resistance through controlled crosslinking, resolving the contradiction between ease of manufacture and temperature resistance.
Solution Approach 2:
The patent incorporates preliminary crosslinking preparation in the adhesive formulation before spin coating. The pre-formulated crosslinking system activates during the spin coating and heating process, ensuring that heat resistance is established early in the manufacturing process while maintaining good coatability, thus resolving the contradiction between spin coatability and heat resistance.
4Temperature
If conventional polysiloxane adhesive systems are used, then heat resistance is maintained, but spin coatability and easy peelability are insufficient
Solution Approach 1:
The patent creates a composite adhesive system by modifying conventional polysiloxane with polyether groups and combining it with specific crosslinking agents. This composite structure maintains the heat resistance of polysiloxane while adding the spin coatability and peelability benefits of polyether modification, thus resolving the contradiction between heat resistance and ease of operation.
Solution Approach 2:
The patent changes the chemical structure parameters of the polysiloxane by introducing polyether modifications and controls the molecular weight and crosslinking ratio. These parameter changes enable the adhesive to maintain heat resistance while achieving improved spin coatability and peelability, resolving the contradiction between temperature resistance and ease of operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive ensures excellent spin coatability, heat resistance, and easy peelability, enabling efficient processing and separation of wafers without deformation or detachment, while maintaining laminate integrity.
Implementation Method 1
component (A1) containing a polysiloxane (a1) and a polysiloxane (a2), in which the polysiloxane (a1) includes a polyorganosiloxane containing at least one unit selected from the group consisting of a siloxane unit represented by SiO2 (Q unit), a siloxane unit represented by R1R2R3SiO1/2 (M unit), a siloxane unit represented by R4R5SiO2/2 (D unit), and a siloxane unit represented by R6SiO3/2 (T unit) (the R1 to R6 each independently represent an alkyl group having 1 to 10 carbon atoms or an alkenyl group having 2 to 10 carbon atoms, and are bonded to a silicon atom by a Si—C bond, and the polysiloxane contains an alkyl group having 1 to 10 carbon atoms and an alkenyl group having 2 to 10 carbon atoms), and the polyorganosiloxane (a2) includes a polysiloxane containing at least one unit selected from the group consisting of a siloxane unit represented by SiO2 (Q unit), a siloxane unit represented by R1R2R3SiO1/2 (M unit), a siloxane unit represented by R4R5SiO2/2 (D unit), and a siloxane unit represented by R6SiO3/2 (T unit) (the R1 to R6 each independently represent an alkyl group having 1 to 10 carbon atoms or a hydrogen atom, and are bonded to a silicon atom by a Si—C bond or an Si—H bond, and the polysiloxane contains an alkyl group having 1 to 10 carbon atoms and an Si—H group)
Implementation Method 2
component (A2) containing a platinum group metal-based catalyst
Implementation Method 3
performing heating in a bonding state in which the first body and the coating film are in contact with each other and the coating film and the second body are in contact with each other
Data Source
AI summary
An adhesive for peelably bonding between a support and a circuit surface of a wafer to allow for processing of a back surface of the wafer, the adhesive including a component (A) that cures through a hydrosilylation reaction and a component (B) containing a polyether-modified siloxane.