Polyetherimide Films via Extrusion for High-Temperature Capacitors
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Solution Overview
Problem
There is a need for high-purity, high-breakdown-strength, and high-dielectric-constant polyetherimide films suitable for high-temperature applications, with efficient industrial-scale production methods that are environmentally friendly, as existing films like BOPP and PET have limitations in energy density and operating temperature, and solvent-casting processes are costly and wasteful.
Innovation Solution
Polyetherimide films are manufactured through extrusion using a specific polymerization of aromatic dianhydrides with meta-phenylene or para-phenylene diamines, endcapped with aromatic primary monoamines, resulting in high yield, high-purity films with improved dielectric properties and thermal stability, and are produced in a solventless process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If solvent-casting process is used to manufacture polyetherimide films, then dielectric constant and operating temperature are improved, but manufacturing cost increases and solvent residue problems occur
Solution Approach 1:
The patent changes the manufacturing process parameters from solvent-casting to extrusion processing. This parameter change eliminates the need for solvents while maintaining the high dielectric constant (≥3.0) and high operating temperature (≥200°C) properties of polyetherimide films, thereby reducing manufacturing cost and avoiding solvent residue issues.
2Productivity
If extrusion process is used to manufacture polyetherimide films, then manufacturing efficiency is improved, but film purity and quality are compromised
Solution Approach 1:
The patent applies preliminary action by pre-drying the polyetherimide material to remove moisture and pre-filtering the melt through filters before extrusion. These preliminary actions ensure that the extrusion process produces high-purity films with excellent electrical properties, maintaining film purity ≥99% while achieving high manufacturing efficiency.
3Quantity of substance
If film thickness is reduced to maximize energy storage, then volumetric energy density is improved, but breakdown strength requirements become more stringent
Solution Approach 1:
The patent changes the material parameters by using extrusion-processed polyetherimide with optimized molecular weight distribution and reduced impurities. This parameter change enables the film to achieve high breakdown strength (≥300 V/μm) even at reduced thickness, thereby maximizing volumetric energy density while maintaining reliability.
4Manufacturing precision
If polyetherimide content before extrusion is increased to improve film quality, then dielectric properties are enhanced, but processing difficulty increases
Solution Approach 1:
The patent applies preliminary action by pre-drying the polyetherimide material to remove moisture and pre-mixing with lubricants and stabilizers before extrusion. These preliminary actions reduce processing difficulty by preventing moisture-related defects and improving melt flow characteristics, enabling high dielectric properties to be achieved with standard extrusion equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The extruded polyetherimide films achieve high yield, with at least 90% of the polyetherimide content before extrusion, exhibiting enhanced dielectric constants, breakdown strength, and thermal stability, enabling high-energy density capacitors that operate effectively at elevated temperatures without the environmental and cost issues of solvent-casting.
Implementation Method 1
When a voltage is applied across the plates, the electric field on the dielectric displaces electric charges, and thus stores energy
Implementation Method 2
extrusion has been proposed for the manufacture of polyetherimide films
Data Source
AI summary
A polyetherimide film comprising a fluoropolymer and an extruded polyetherimide comprising units derived from polymerization of an aromatic dianhydride with a diamine selected from a meta-phenylene diamine, a para-phenylene diamine, and a combination thereof, wherein the polyetherimide is endcapped with an a substituted or unsubstituted aromatic primary monoamine; and wherein the polyetherimide film comprises at least 90 weight % of the polyetherimide before extrusion.


