Polyfunctional Thiol Curing Agent for Tack-Free Epoxy Resins
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Solution Overview
Problem
Existing thiol compounds used as curing agents for epoxy resins cause adhesion to fingers during curing, affecting the surface state of the cured product, and there is a need for a compound that provides high elongation, low elasticity, and tack-free performance.
Innovation Solution
A polyfunctional thiol compound with a specific structure, represented by general formula (I), is used as a curing agent for epoxy resins, enabling rapid curing and producing a cured product with good tack-free properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a bifunctional thiol compound with a long molecular chain is used as a curing agent for epoxy resins, then the cured product achieves high elongation and low elasticity with excellent impact resistance, but the surface of the cured product becomes tacky and adheres to fingers during curing
Solution Approach 1:
The patent changes the molecular structure parameters of the thiol compound by introducing a specific polyfunctional core structure (pentaerythritol, dipentaerythritol, or trimethylolpropane) with multiple thiol groups. This structural parameter change enables the compound to achieve both high elongation/low elasticity and tack-free performance simultaneously, resolving the contradiction between impact resistance and adhesion to fingers
Solution Approach 2:
The patent creates a composite curing system by combining a polyfunctional thiol compound with specific epoxy resin types (aromatic glycidyl ether, cycloaliphatic glycidyl ether, or aliphatic glycidyl ether). This composite approach allows the cured product to achieve both mechanical properties (high elongation, low elasticity) and surface properties (tack-free performance) that cannot be obtained with single-component systems
2Object-affected harmful factors
If a polyfunctional thiol compound with a specific structure is used as a curing agent, then the cured product achieves good tack-free performance, but the curing process requires precise control of reaction conditions
Solution Approach 1:
The patent optimizes the molecular weight and thiol group content parameters of the polyfunctional compound to achieve a balance between tack-free performance and curing control. By controlling the molecular weight within specific ranges and adjusting the number of thiol groups, the patent enables precise control of curing kinetics while maintaining good tack-free properties
3Productivity
If a thiol compound is used as a curing agent for epoxy resins, then the curing reaction proceeds rapidly, but the compound must maintain stability against hydrolysis and oxidation during storage and application
Solution Approach 1:
The patent modifies the chemical structure parameters of the thiol compound by introducing electron-withdrawing groups and optimizing the molecular framework. These parameter changes enhance both the reactivity (curing rate) and stability (hydrolysis resistance) of the compound, allowing rapid curing while maintaining reliability during storage and application
Solution Approach 2:
The patent uses a polyfunctional core structure (pentaerythritol, dipentaerythritol, or trimethylolpropane) as an intermediary framework that bridges the contradiction between reactivity and stability. This core structure provides a stable backbone that resists hydrolysis while supporting multiple reactive thiol groups that enable rapid curing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thiol compound achieves high elongation and low elasticity in the cured epoxy resin, providing excellent impact resistance and tack-free performance while maintaining low-temperature curability and hydrolysis resistance.
Implementation Method 1
a compound having a plurality of thiol groups within the molecule have been subjected to various research
Implementation Method 2
compounds having a plurality of thiol groups within the molecule have been subjected to various research
Data Source
AI summary
The present invention is to provide a novel thiol compound used for curing of epoxy resins, etc. Specifically, the present invention is to provide a compound represented by the general formula (I), a curing agent for epoxy resins, and an epoxy resin composition comprising the compound of formula (I):