Polyfunctional Thiol Curing Agent for Tack-Free Epoxy Resins
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Solution Overview
Problem
Existing thiol compounds used as curing agents for epoxy resins cause adhesion to fingers during curing, affecting the surface state of the cured product, and there is a demand for a compound that provides high elongation, low elasticity, and tack-free performance.
Innovation Solution
A polyfunctional thiol compound with specific structural features, represented by the general formula (I), is used as a curing agent for epoxy resins, ensuring rapid curing and providing a tack-free cured product with high elongation and low elasticity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a bifunctional thiol compound with a long molecular chain is used as a curing agent for epoxy resins, then the cured product achieves high elongation and low elasticity with excellent impact resistance, but the compound causes adhesion to fingers during curing, affecting the surface state of the cured product
Solution Approach 1:
The patent changes the molecular structure parameters of the thiol compound by introducing polyfunctional groups (tri- or tetrafunctional) instead of bifunctional groups, and by controlling the molecular weight and structural configuration (including cyclic and chain structures). This structural parameter change enables the compound to achieve high elongation and impact resistance while eliminating the adhesion problem during curing.
Solution Approach 2:
The patent employs composite molecular structures combining multiple functional groups within a single molecule (polyfunctional thiol compounds with both cyclic and chain structures). These composite structures provide multiple reactive sites that enhance curing performance and mechanical properties while maintaining tack-free surface characteristics.
2Stability of the object's composition
If a polyfunctional thiol compound is used to achieve high elongation and low elasticity, then the cured product exhibits excellent mechanical properties, but the compound may cause adhesion to fingers during curing
Solution Approach 1:
The patent optimizes the molecular weight and structural configuration parameters of polyfunctional thiol compounds. By controlling the degree of functionality (tri- or tetrafunctional groups) and the specific molecular architecture (cyclic versus chain structures), the compound achieves high elongation and low elasticity while maintaining tack-free surface properties during curing.
3Productivity
If a thiol compound is used as a curing agent for epoxy resins, then the curing process proceeds rapidly, but the surface state of the cured product may be affected by adhesion to fingers
Solution Approach 1:
The patent modifies the molecular structure parameters of the thiol compound by introducing polyfunctional groups and controlling molecular weight distribution. These parameter changes enable rapid curing kinetics while ensuring the cured product surface remains tack-free and free from adhesion defects, thus maintaining manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The compound achieves rapid curing of epoxy resins with excellent tack-free properties, high elongation, and low elasticity, while maintaining impact resistance and hydrolysis resistance.
Implementation Method 1
a compound having a specific thiol group, while being a polyfunctional thiol compound that develops high elongation and low elasticity, is effective as a curing agent or the like
Implementation Method 2
an uncured cured product adhered to the finger or the like, and there were cases where the surface state of the cured product was affected
Data Source
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AI summary
The present invention is to provide a novel thiol compound used for curing of epoxy resins, etc. Specifically, the present invention is to provide a compound represented by the general formula (I), a curing agent, and an epoxy resin composition containing the compound of the formula (I).