Polyfunctional Vinyl Resin for Low-Dielectric Heat-Resistant Curing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional vinyl resins fail to provide cured products with sufficient heat resistance, low dielectric tangent, and low permittivity, especially in high-frequency applications, and are inadequate in terms of moldability and reliability for electrical insulation materials.
Innovation Solution
A polyfunctional vinyl resin represented by a specific general formula, produced through the reaction of dicyclopentadiene with 2,6-disubstituted phenol, followed by reaction with an acid anhydride or acid halide, resulting in a resin composition with high solvent solubility, low permittivity, and low dielectric tangent, suitable for high-speed telecommunication applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional vinyl resins are used, then the material can be processed relatively easily, but the heat resistance and dielectric properties are insufficient
Solution Approach 1:
The invention changes the chemical parameters of the vinyl resin by introducing specific functional groups (vinylbenzyl ether groups, carboxyl groups) and controlling the molecular structure (polyfunctional structure with specific formula). This transforms the resin's properties to achieve high heat resistance (glass transition temperature ≥180°C) and low dielectric tangent while maintaining processability through controlled molecular weight and functional group distribution.
Solution Approach 2:
The invention creates a composite chemical structure within the vinyl resin molecule, combining phenolic hydroxyl groups, vinylbenzyl ether groups, and carboxyl groups in a specific polyfunctional architecture. This composite molecular structure integrates multiple functions: heat resistance from the phenolic core, dielectric properties from the vinylbenzyl ether groups, and controlled reactivity from the carboxyl groups, resolving the contradiction between performance and processability.
2Ease of operation
If the molecular weight of PPE is decreased to improve solvent solubility, then convenience during prepreg production is enhanced, but dielectric properties and heat resistance are reduced
Solution Approach 1:
Instead of simply decreasing molecular weight, the invention changes the chemical composition parameters by introducing polyfunctional structures with specific ratios of hydroxyl groups, vinylbenzyl ether groups, and carboxyl groups. The controlled functional group distribution and molecular architecture (general formula (1)) enable high solvent solubility while maintaining high glass transition temperature and excellent dielectric properties, reversing the traditional trade-off.
3Temperature
If vinyl benzyl ether resins with specific structures are used to improve heat resistance, then thermal stability is enhanced, but dielectric properties remain insufficient
Solution Approach 1:
The invention creates a composite molecular structure where phenolic hydroxyl groups provide heat resistance, vinylbenzyl ether groups provide low dielectric tangent and permittivity, and carboxyl groups contribute to both properties. This multi-functional composite architecture (general formula (1)) simultaneously achieves high glass transition temperature and excellent dielectric properties, resolving the contradiction between thermal stability and dielectric performance.
4Reliability
If the resin structure is modified to improve dielectric properties, then low permittivity and dielectric tangent are achieved, but moldability deteriorates due to high viscosity
Solution Approach 1:
The invention optimizes the molecular weight parameters and functional group distribution within the polyfunctional vinyl resin structure. By controlling the average molecular weight and the ratio of different functional groups (hydroxyl, vinylbenzyl ether, carboxyl), the resin achieves low viscosity for good moldability while maintaining the molecular structure necessary for low dielectric tangent and permittivity, thus resolving the contradiction between dielectric performance and processability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves high glass transition temperature, low dielectric tangent, and low permittivity, enhancing heat resistance and solvent solubility, making it suitable for electronic materials in high-frequency communication and providing improved reliability and processability.
Implementation Method 1
produced through the reaction of dicyclopentadiene with 2,6-disubstituted phenol
Implementation Method 2
cured resins using vinyl resins with various chemical structures have conventionally been suggested
Data Source
AI summary
To provide a resin material exhibiting low permittivity and low dielectric tangent and also having high heat resistance while having high solvent solubility. A polyfunctional vinyl resin represented by the following general formula (1), wherein each R1 independently represents a hydrocarbon group having 1 to 8 carbon atoms, each R2 independently represents a hydrogen atom, or a dicyclopentenyl group, and at least one R2 is a dicyclopentenyl group; each X represents a hydrogen atom or a vinyl group-containing group represented by the formula (1a), and at least one X is a vinyl group-containing group; R3 represents a hydrogen atom or an alkyl group or an alkenyl group having 1 to 8 carbon atoms; and n represents the number of repetitions and an average value thereof is a number of 1 to 5.