Polygonal Ceramic Heat Pipes for AR/VR RF Transparency
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Solution Overview
Problem
Existing heat pipes and vapor chambers used in augmented reality/virtual reality (AR/VR) devices are limited by their size, weight, and interference with radio frequency (RF) signals, and their manufacturing process is time-consuming and expensive, while also requiring separate wick structures which add complexity.
Innovation Solution
The development of polygonal-shaped ceramic or polymeric heat pipes and vapor chambers that are RF compatible, utilizing materials like ceramic, polymer, or glass, which eliminate the need for separate wick structures and improve capillary action through acute angles, enhancing thermal conductivity and RF transparency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal heat pipes or vapor chambers are used, then thermal conductivity is improved, but radio frequency signal interference increases
Solution Approach 1:
The patent changes the material parameter from metal to ceramic or polymeric materials that are RF transparent, eliminating RF signal interference while maintaining thermal management functionality through alternative material properties
Solution Approach 2:
The patent uses ceramic or polymeric composite materials that combine RF transparency with adequate thermal conductivity properties, replacing traditional metal materials to resolve the conflict between thermal performance and RF compatibility
2Ease of manufacture
If traditional manufacturing processes are used, then heat pipes can be manufactured, but manufacturing time and cost increase
Solution Approach 1:
The patent merges the shell and wick structure into a single integrated component, eliminating separate manufacturing and assembly steps, which reduces manufacturing time and complexity while maintaining functionality
Solution Approach 2:
The polygonal-shaped ceramic or polymeric material serves multiple functions simultaneously: it provides the structural shell, the wick structure for capillary action, and the RF-transparent housing, simplifying the overall manufacturing process
3Reliability
If separate wick structures are added to metal heat pipes, then capillary action is improved, but device complexity increases
Solution Approach 1:
The patent combines the wick structure and shell into a single integrated component made of ceramic or polymeric material with inherent capillary channels, eliminating the need for separate wick insertion and reducing assembly complexity
Solution Approach 2:
The patent uses porous ceramic or polymeric materials that provide capillary action through their inherent pore structure, eliminating the need for separate metal wick structures while maintaining reliable liquid transport
4Reliability
If polygonal shapes are used, then capillary action is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
The patent changes the material to ceramic or polymeric materials that can be formed into polygonal shapes with acute angles using standard molding or casting techniques, achieving the desired capillary effect without excessive precision requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These RF-compatible heat pipes efficiently transfer heat within AR/VR devices, reducing manufacturing costs and complexity, while maintaining high thermal conductivity and increasing the available surface area for heat dissipation without interfering with RF signals.
Implementation Method 1
Heat pipes and vapor chambers are often used to redirect heat within AR/VR devices
Implementation Method 2
By making the heat pipes or vapor chambers polygonal in shape, i.e., having a polygonal-shaped cross-section, the corners promote capillary action, which improves performance relative to cylindrical heat pipes or parallel plate vapor chambers
Data Source
AI summary
An elongated heat pipe is described. In examples, the heat pipe may include a body comprising a polygonal-shaped cross-section and a RF compatible material, e.g., a ceramic, a polymer, glass, etc. The heat pipe may further include a working fluid disposed within the body.