Heat Conductive Polygonal Column in Module Board Through-Hole
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Solution Overview
Problem
Conventional module boards with heat dissipation sheets struggle to achieve sufficient heat dissipation from semiconductor devices, leading to inefficient thermal management.
Innovation Solution
Incorporating a heat conductive polygonal column within a through-hole of the printed board, connected to the semiconductor device's terminals, which enhances heat transfer by providing a wide cross-sectional area for heat dissipation and improves electrical characteristics through secure grounding and power supply connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If only a heat dissipation sheet is used on the rear surface of the printed board, then the structure remains simple, but heat dissipation is insufficient
Solution Approach 1:
The heat dissipation function is segmented into multiple components: the heat dissipation sheet on the rear surface and the heat conductive column extending through the printed board from the front surface to the rear surface. This segmentation allows heat to be dissipated through multiple pathways simultaneously, improving overall heat dissipation effectiveness while maintaining reasonable structural complexity
Solution Approach 2:
The heat dissipation structure is extended from a two-dimensional heat dissipation sheet into the third dimension by adding the heat conductive column that penetrates through the printed board thickness. This dimensional transition creates additional heat transfer pathways and increases the effective heat dissipation surface area
2Temperature
If a heat dissipation sheet is added to improve heat dissipation, then thermal management improves, but the device complexity increases
Solution Approach 1:
The heat conductive column serves multiple functions simultaneously: it acts as a heat dissipation pathway conducting thermal energy from the front surface to the rear surface, provides electrical connection between terminals on the front surface and the rear surface, and reinforces the structural integrity of the printed board. This multi-functionality reduces the need for separate components
Solution Approach 2:
The heat conductive column merges the heat dissipation function with the electrical connection function and structural support function into a single integrated component. By combining these functions, the overall device complexity is reduced compared to having separate heat dissipation sheets, electrical connectors, and structural elements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration efficiently dissipates heat from the semiconductor device while strengthening its electrical connections, improving thermal management and electrical performance without increasing costs or complexity.
Implementation Method 1
a heat conductive polygonal column which is included in the through-hole and connected to a terminal of the semiconductor device
Data Source
AI summary
A module board of an embodiment includes a printed board having a through-hole, a semiconductor device mounted on the printed board so as to cover the through-hole, and a heat conductive polygonal column included in the through-hole. The semiconductor device includes a ground terminal or a power supply terminal, the polygonal column is supported by the through-hole at the corners of the polygonal column, and the polygonal column is connected to the ground terminal or the power supply terminal.