Polygonal Core-Shell Dielectric Grains for Thin MLCC Reliability

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Solution Overview

Problem

Multilayer ceramic capacitors face challenges in miniaturization and high capacitance due to decreased insulation resistance and reliability as dielectric layers are thinned, leading to decreased dielectric capacitance and DC-bias characteristics.

Innovation Solution

A multilayer electronic component with a dielectric layer comprising dielectric grains having a core-shell structure, where the core portion has a polygonal shape and a high volume fraction, improving dielectric capacitance and DC-bias characteristics by optimizing the core and shell portions' dimensions and materials.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the dielectric layer is thinned to achieve miniaturization and high capacitance, then the capacitance increases and size decreases, but the insulation resistance value decreases and reliability decreases

Engineering Contradiction:
ImprovecapacitanceVSAvoidinsulation resistance
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The dielectric layer is divided into two regions with different properties: a core portion with improved crystallinity for high capacitance and a shell portion with additives for high insulation resistance. This local differentiation allows each region to optimize its function, resolving the contradiction between capacitance and insulation resistance.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The dielectric layer employs a composite structure combining a core portion made of perovskite-based dielectric material with a shell portion containing rare earth element additives. This composite material approach enables simultaneous achievement of high capacitance (core) and high insulation resistance (shell).

Inventive Principle:
Principle #40Composite materials

2Volume of moving object

If the dielectric layer is thinned to achieve miniaturization, then the component size decreases, but the dielectric capacitance characteristics decrease

Engineering Contradiction:
Improvecomponent sizeVSAvoiddielectric capacitance
Core Design Contradiction:
Volume of moving objectVSQuantity of substance

Solution Approach 1:

The invention changes the crystallinity parameter of the core portion through controlled sintering conditions and material composition, enabling high dielectric capacitance to be achieved even in thinned dielectric layers. This parameter optimization allows miniaturization without sacrificing capacitance characteristics.

Inventive Principle:
Principle #35Parameter changes

3Volume of moving object

If the dielectric layer is thinned to achieve miniaturization, then the component size decreases, but the DC-bias characteristics decrease

Engineering Contradiction:
Improvecomponent sizeVSAvoidDC-bias characteristics
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The shell portion is specifically designed with rare earth element additives to provide high insulation resistance and stable DC-bias characteristics, while the core portion provides capacitance. This local functional differentiation maintains DC-bias performance in miniaturized components.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS20250022656A1Multilayer electronic component
Publication Date: 2025.01.16 SAMSUNG ELECTRO MECHANICS CO LTD
  • US20250022656A1 patent drawing
  • US20250022656A1 patent drawing
  • US20250022656A1 patent drawing

AI summary

A multilayer electronic component, may include a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body, wherein the dielectric layer may include a plurality of dielectric grains, at least one of the plurality of dielectric grains may have a core-shell structure including a core portion and a shell portion surrounding at least a portion of the core portion, a cross-section of the core portion may include a polygonal shape, an average length of the plurality of dielectric grains may be 80 nm or more and 200 nm or less, and a length of the core portion, as compared to a length of a corresponding dielectric grain, may be 70% or more.