Polygonal Linking Die Assembly for Higher-Density Hybrid Bonding
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Solution Overview
Problem
Conventional semiconductor packaging technologies face challenges in efficiently utilizing unoccupied or nonoverlapping areas in die assemblies, leading to suboptimal integration density and performance.
Innovation Solution
Introduction of polygonal linking dies, which are bonded using hybrid bonding structures, to fill these unoccupied areas and increase vertical electrical connection points, utilizing plasma dicing for fabrication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional semiconductor packaging is used, then manufacturing process is simple, but integration density is suboptimal due to unoccupied areas
Solution Approach 1:
The patent implements a multi-level die stacking architecture where dies are arranged in vertical levels (first level, second level, third level) with linking dies positioned between levels. This nesting approach fills unoccupied areas by utilizing vertical space, thereby improving integration density without proportionally increasing horizontal package area.
Solution Approach 2:
The patent transitions from conventional two-dimensional die arrangement to a three-dimensional structure by introducing vertical levels and linking dies that connect across levels. This dimensional change allows efficient utilization of unoccupied areas by placing functional elements in the vertical dimension, thus improving integration density.
2Manufacturing precision
If die area is maximized, then integration density improves, but electrical connection points become insufficient
Solution Approach 1:
The patent divides the electrical connection function across multiple linking dies (first linking die, second linking die) positioned at different locations and levels. Each linking die provides additional connection points, and their distributed arrangement ensures sufficient electrical connections while maintaining high integration density throughout the package structure.
Solution Approach 2:
The patent resolves the connection points limitation by moving from horizontal connection arrangements to vertical connections across multiple levels. Linking dies positioned between first, second, and third levels provide additional electrical connection points in the vertical dimension, thereby increasing total connection capacity without reducing die area.
3Ease of manufacture
If unoccupied areas are left empty, then manufacturing is easier, but chip area utilization is suboptimal
Solution Approach 1:
The patent introduces linking dies that serve multiple functions: they fill unoccupied areas between stacked dies, provide electrical connection points between levels, and act as structural support elements. This multi-functionality allows the same structural elements to address both area utilization and manufacturing simplicity by using standardized die configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances integration density and performance by maximizing the utilization of available chip area and providing additional electrical connection points through hybrid bonding.
Implementation Method 1
both the first bottom die and the second bottom die using hybrid bonding structures
Implementation Method 2
utilizing plasma dicing for fabrication
Data Source
AI summary
A semiconductor die assembly is provided. The semiconductor die assembly includes: a first bottom die and a second bottom die disposed at a bottom vertical level; a first top die disposed at a top vertical level above the bottom vertical level in a vertical direction and bonded to the first bottom die; a second top die disposed at the top vertical level and bonded to the second bottom die; and a linking die disposed at the top vertical level and bonded to both the first bottom die and the second bottom die. The linking die is characterized by a polygonal shape in a horizontal plane perpendicular to the vertical direction, and the polygonal shape is not a rectangle.