Polygonal Module Substrate Side Heat Dissipation
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Solution Overview
Problem
Existing module designs with heat-producing components face inadequate heat dissipation due to limited heat transfer from only one side surface of the substrate, leading to potential performance degradation and malfunction.
Innovation Solution
A module with a polygonal substrate featuring conductor films extending to multiple side surfaces, allowing heat from electronic components to be dissipated through side electrodes on different surfaces, enhancing heat dispersion and dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If heat dissipation is implemented through only one side surface of the substrate, then the structure is simple, but the heat dissipation properties are insufficient
Solution Approach 1:
The patent extends heat dissipation from a single surface (2D limitation) to multiple side surfaces of the substrate, utilizing the three-dimensional space around the substrate. Conductor films are routed to reach different side surfaces, creating multiple heat dissipation pathways in different spatial dimensions, thereby improving heat dissipation properties without significantly complicating the overall structure.
2Reliability
If conductor films are extended to multiple side surfaces to improve heat dissipation, then heat dissipation properties are enhanced, but the device complexity increases
Solution Approach 1:
The conductor films are designed to serve dual functions: electrical connection between electronic components and side electrodes, and heat dissipation pathways. By making the conductor films multi-functional, the patent avoids adding separate dedicated heat dissipation structures, thereby enhancing heat dissipation properties without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves heat dissipation properties by dispersing heat across multiple paths, reducing thermal resistance and preventing heat concentration, thus enhancing module performance and reliability.
Implementation Method 1
the heat caused in the heat-producing component is transferred to the electromagnetic shielding material through the conductor film
Data Source
AI summary
A module includes a substrate, which has a polygonal shape in a plan view, an electronic component and an electronic component, which are mounted on a main surface of the substrate, and side electrodes, which are provided on at least two side surfaces of a plurality of side surfaces that form the polygonal shape of the substrate. A conductor film coupled to the electronic component and a conductor film coupled to the electronic component are provided on the substrate. The conductor film extends to reach a side surface of the at least two side surfaces to be coupled to a side electrode provided on the side surface. The conductor film extends to reach a side surface of the at least two side surfaces, which is different from the side surface, to be coupled to a side electrode provided on the side surface.