Polygonal Power Supply Layer for PCB Noise Suppression
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing multilayer printed wiring boards require a large number of decoupling capacitors to absorb noise voltage between the power supply and ground wiring layers, leading to increased component count and complexity.
Innovation Solution
A multilayer printed wiring board design where the power supply wiring layer is configured as a polygon formed by straight lines linking through holes, allowing decoupling capacitors mounted near integrated circuits to absorb noise voltage, thereby reducing the need for additional peripheral decoupling capacitors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large number of decoupling capacitors are mounted at the perimeter region to absorb noise voltage, then noise suppression is improved, but device complexity and component count increase
Solution Approach 1:
The patent applies multi-functionality by enabling the decoupling capacitors mounted near integrated circuits to serve dual purposes: suppressing noise from the circuits and absorbing noise voltage between power supply and ground wiring layers. This eliminates the need for separate perimeter decoupling capacitors, reducing component count while maintaining noise suppression effectiveness
Solution Approach 2:
The patent merges the functions of circuit noise suppression and noise voltage absorption by using the same decoupling capacitors for both purposes. The capacitors near integrated circuits are configured to handle both the noise from the circuits themselves and the noise voltage generated by the power supply system, combining multiple functions into a single component placement
2Reliability
If solid wiring is used for power supply and ground layers, then electrical connection is improved, but electromagnetic radiation increases
Solution Approach 1:
The patent converts the harmful noise voltage generated by the solid wiring configuration into a beneficial effect by using decoupling capacitors to absorb this noise voltage. The noise voltage that would otherwise cause electromagnetic radiation is instead captured and absorbed by the capacitors, transforming a harmful byproduct of the solid wiring into a controlled and mitigated phenomenon
Solution Approach 2:
The patent introduces decoupling capacitors as intermediary elements between the power supply wiring layer and ground wiring layer. These capacitors act as mediators that absorb the noise voltage generated by the solid wiring configuration, preventing the noise from propagating as electromagnetic radiation while maintaining the electrical connection benefits of solid wiring
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively bypasses and absorbs noise voltage between the power supply and ground wiring layers, minimizing the number of decoupling capacitors required and simplifying the board design.
Implementation Method 1
decoupling capacitors mounted near integrated circuits to absorb noise voltage
Data Source
AI summary
The invention provides a multilayer printed wiring board including: a power supply wiring layer and a ground wiring layer provided so as to oppose each other via an insulation layer; mounted integrated circuits; and decoupling capacitors mounted in proximity to the integrated circuits and connected between the power supply wiring layer and the ground wiring layer to absorb noise from the integrated circuits. The power supply wiring layer includes through holes for connecting the decoupling capacitors to the power supply wiring layer and has a polygonal form formed by straight lines which link some of the through holes.