Polygon IC Packaging with PP Connector for Increased I/O Routes
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Solution Overview
Problem
Traditional IC packaging designs with square corners limit the number of input/output (I/O) routes, which is a challenge for future data handling systems requiring reduced size and increased connectivity between IC devices and carriers.
Innovation Solution
The implementation of a package-to-package (PP) connector with cabling between first and second cabling connectors, seated to carrier connectors on polygon IC device packages, allowing for increased I/O routes by providing electrical paths between IC devices and system boards, even with smaller IC device sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional square IC packaging designs are used, then manufacturing is simple, but the number of I/O routes is limited
Solution Approach 1:
The patent applies asymmetry by transitioning from traditional square IC packaging to polygonal IC packaging with rounded corners. This geometric modification allows I/O routes to be positioned along the rounded edges and corners, significantly increasing the number of available I/O connections while maintaining manufacturing feasibility through standardized fabrication processes
2Volume of moving object
If IC device size is reduced, then system size is reduced, but connectivity between IC devices and carriers is limited
Solution Approach 1:
The patent utilizes dimensional change by moving I/O connections from traditional edge-only positions to include rounded corners and curved edges of polygonal packages. This effectively adds dimensional space for connectivity, allowing multiple I/O routes to be distributed along the perimeter including corners, thereby maintaining high connectivity even as device size decreases
3Adaptability or versatility
If polygon IC device packages are used, then the number of I/O routes is increased, but device complexity is increased
Solution Approach 1:
The patent applies curvature by using rounded corners and curved edges in polygonal IC packaging instead of sharp angles. This curvature design naturally provides additional space for I/O routes along the rounded perimeters while maintaining a simple overall polygonal structure that is straightforward to manufacture, thus increasing connectivity without proportionally increasing complexity
Data Source
AI summary
An electronic system includes two integrated circuit (IC) packages that are connected by a package to package (PP) connector. The PP connector may include cabling between a first cabling connector and a second cabling connector. The first cabling connector may be seated to a first carrier connector upon a first IC device carrier of the first IC device package. The second cabling connector may be seated to a second carrier connector upon a second IC device carrier of the second IC device package. The electronic system may further include a heat sink connected to the IC packages, to the first cabling connector, and to the second cabling connector. An IC device may route I/O data through the PP connector, effectively increasing the number of I/O routes.