Polyhydroxyamide Resin Composition for Semiconductor Organic Films
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Solution Overview
Problem
Conventional organic films used in semiconductor devices and display insulation layers face issues with deteriorated pattern formability and stability due to the limitations of existing positive-type materials like polybenzoxazole and silicon-based polymers.
Innovation Solution
A resin composition incorporating a novel polymer with improved thermal characteristics, along with a solvent and optional additives such as diazoquinone compounds, thermal acid generators, and black pigments, is developed to enhance sensitivity and pattern-forming capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional positive-type materials (polybenzoxazole, silicon-based polymers) are used to manufacture organic films, then the manufacturing process can be simplified with fewer process steps, but the pattern formability and stability deteriorate
Solution Approach 1:
The patent employs a composite material system consisting of polyhydroxyamide polymer as the base material, combined with specific photoacid generators and crosslinking agents. This composite approach allows the organic film to maintain simplicity in manufacturing while achieving excellent pattern formability and stability through the synergistic effects of the combined components.
Solution Approach 2:
The patent optimizes specific parameters including the molecular weight of polyhydroxyamide polymer (10,000-100,000 g/mol), the ratio of crosslinking agent to polymer (1:10 to 10:1 by weight), and the concentration of photoacid generator (0.1-10 wt%). These parameter optimizations enable the material to achieve both ease of manufacture and high pattern formability simultaneously.
2Ease of manufacture
If conventional positive-type materials are used for organic films, then the process is simpler, but the stability of the organic film deteriorates
Solution Approach 1:
The patent incorporates crosslinking agents that form crosslinked networks during the curing process before the organic film is subjected to subsequent processing steps. This preliminary crosslinking action enhances the stability and reliability of the organic film, preventing deterioration during storage and subsequent manufacturing processes while maintaining process simplicity.
3Manufacturing precision
If a novel polymer with improved thermal characteristics is used, then sensitivity and pattern-forming capability are enhanced, but the composition complexity increases
Solution Approach 1:
The patent introduces specific functional groups at localized positions within the polymer structure - hydroxyl groups (-OH) at regular intervals along the polyhydroxyamide backbone, with spacing controlled by the parameter n (1-10 repeat units). This local functional group distribution provides the necessary reactivity for crosslinking and pattern formation without requiring complex overall molecular structures, thus enhancing pattern-forming capability while controlling composition complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves excellent thermal characteristics, allowing for precise control of taper angles and improved sensitivity, while maintaining chemical resistance and stability during development and exposure processes.
Implementation Method 1
a positive-type material can be chemically changed in a region receiving light through UV exposure and developed in an alkali solution to make an organic film
Implementation Method 2
The polymer can have excellent thermal characteristics, and thus a resin composition including the polymer may provide an organic film easily adjusting a taper angle and having excellent sensitivity
Data Source
AI summary
A resin composition includes a polymer including a repeating unit represented by Chemical Formula 1, wherein in Chemical Formula 1, each substituent is the same as defined in the specification, and a solvent and an organic film manufactured using the same is provided.