Polyhydroxyether Laser-Release Layer for 3D IC Temporary Bonding
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Solution Overview
Problem
Current temporary wafer bonding processes require multiple layers and complex coating and baking steps, increasing costs and reducing throughput, whereas a single material capable of functioning as both a temporary bonding layer and laser release layer could significantly reduce costs and improve efficiency.
Innovation Solution
A polyhydroxyether-based composition that absorbs light in specific wavelengths, allowing for laser-induced separation, is used as a single bonding and release layer, eliminating the need for multiple layers and simplifying the bonding and debonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple layers (bonding layer and releasing layer) are used for temporary wafer bonding, then the bonding and release functions are achieved, but the process complexity and cost increase
Solution Approach 1:
The patent combines the bonding layer and releasing layer into a single integrated layer containing both thermoplastic polymer and photodecomposable polymer. This single layer performs both bonding (through thermoplastic adhesion) and release (through photodecomposition), eliminating the need for separate coating and processing steps for each layer, thus reducing process complexity while maintaining functional reliability
Solution Approach 2:
The composite polymer layer serves multiple functions simultaneously: it provides temporary bonding adhesion through the thermoplastic component and enables laser-induced release through the photodecomposable component. This multi-functional design eliminates the need for separate specialized layers, simplifying the overall process while achieving both bonding and release objectives
2Reliability
If multiple layers are used for temporary wafer bonding, then bonding and release are achieved, but the throughput decreases
Solution Approach 1:
By merging the bonding and releasing functions into a single layer, the patent eliminates the sequential coating and baking steps required for multiple layers. The single layer can be applied in one coating operation and processed in one baking step, significantly reducing cycle time and improving manufacturing throughput while maintaining the necessary bonding and release functionality
3Reliability
If multiple layers are used for temporary wafer bonding, then bonding and release are achieved, but the cost increases
Solution Approach 1:
The patent reduces manufacturing cost by combining two separate material applications into one. Instead of coating and baking a bonding layer separately from a releasing layer, the composite layer is applied once and processed once, reducing material costs, processing costs, and overhead associated with multiple sequential operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polyhydroxyether composition enables efficient and stress-free separation of substrates, supporting high-throughput processing and reducing operational costs by acting as both a bonding and release layer, while maintaining structural integrity during substrate handling and processing.
Implementation Method 1
The bonding layer is exposed to laser energy so as to facilitate separation of the first and second substrates
Data Source
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AI summary
Novel thermoplastic polyhydroxyether-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are soluble in commonly-used organic solvents (e.g., cyclopentanone). The compositions can also be used as build-up layers for RDL formation.