Polyimide Adhesion Layer for Delamination-Resistant Chip Packages
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Solution Overview
Problem
Existing semiconductor device packages face reliability challenges due to interfacial delamination caused by thermal and mechanical stress, particularly at high operational temperatures, which affects the electrical, mechanical, and thermal properties of the package.
Innovation Solution
A semiconductor device package is developed that includes an adhesion promoting layer made of a polyimide containing repeating units derived from a tetracarboxylic dianhydride and at least one diamine with a functional group, such as azole moieties, which enhances interfacial adhesion strength across multiple interfaces within the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional materials are used to attach semiconductor die to other components, then the basic attachment function is achieved, but interfacial delamination occurs under thermal and mechanical stress at high operational temperatures
Solution Approach 1:
The patent employs a composite adhesion promoter layer comprising multiple functional components: a polyimide base material providing thermal stability, silane coupling agents forming chemical bonds with both the substrate and overlying materials, and titanium dioxide particles enhancing adhesion and providing stress relief. This multi-component composite structure systematically addresses delamination caused by thermal and mechanical stress through synergistic mechanisms.
Solution Approach 2:
The invention modifies the chemical and physical parameters of the adhesion promoter layer by incorporating materials with specific properties: silane groups that undergo hydrolysis and condensation to form strong chemical bonds, titanium dioxide with high surface area and reactivity, and polyimide with high glass transition temperature. These parameter changes enable the layer to maintain adhesion strength under elevated temperatures and mechanical stress.
2Reliability
If a polyimide adhesion promoter layer is used, then thermal stability is improved, but additional functional groups are needed to enhance adhesion strength further
Solution Approach 1:
The patent merges multiple adhesion-enhancing mechanisms into a single integrated layer: the polyimide matrix provides thermal stability, silane coupling agents provide chemical bonding capability, and titanium dioxide particles provide mechanical interlocking and additional chemical bonding sites. This merging of functions into one composite layer enhances adhesion strength without proportionally increasing device complexity.
Solution Approach 2:
The adhesion promoter layer is designed with multi-functionality: it provides thermal stability through polyimide, chemical bonding through silane groups that can bond to both organic and inorganic substrates, mechanical reinforcement through titanium dioxide particles, and stress relief through the composite structure. This universal design addresses multiple adhesion challenges simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of a functionalized polyimide adhesion promoting layer significantly improves the interfacial adhesion strength, mitigates delamination, and enhances the thermo-mechanical properties of the semiconductor device package, ensuring reliable performance even at high operational temperatures.
Implementation Method 1
an adhesion promoting layer in contact with the first surface on a first side and the second surface on a second side. The adhesion promoting layer comprises a polyimide containing repeating units derived from a tetracarboxylic dianhydride and at least one diamine containing a functional group
Data Source
AI summary
Semiconductor device packages are provided. In one example, a semiconductor device package comprises a first structure having a first surface in the semiconductor device package, a second structure having a second surface in the semiconductor device package, and an adhesion promoting layer in contact with the first surface on a first side and the second surface on a second side. The adhesion promoting layer comprises a polyimide containing repeating units derived from a tetracarboxylic dianhydride and at least one diamine containing a functional group.