Soluble Polyimide Adhesive Resin Composition for Heat Resistance
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Solution Overview
Problem
Existing polyimide-based adhesives face a trade-off between temperature resistance and adhesive performance, with high temperature resistance often compromising solubility and usability, and improved adhesive performance leading to reduced heat resistance and increased coefficient of thermal expansion.
Innovation Solution
A resin composition comprising a soluble polyimide generated from a reaction of aromatic tetracarboxylic dianhydride and diacid dihydrazide, with a curing agent such as multifunctional epoxy resin, primary amine compounds, and polyisocyanate, which maintains excellent heat resistance, adhesive performance, and solubility through a specific hydrazide structure and molar ratios.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If rigid structures are introduced to improve temperature resistance, then heat resistance is improved, but adhesive performance and solubility deteriorate
Solution Approach 1:
The patent changes the chemical structure parameters by introducing a hydrazide structure into the polyimide main chain, which fundamentally alters the molecular characteristics to achieve both high heat resistance and good adhesive performance simultaneously
Solution Approach 2:
The patent creates a composite adhesive system by combining soluble polyimide with specific curing agents (epoxy resin, polyisocyanate, or amine compounds) in controlled mass ratios, achieving synergistic effects that resolve the contradiction between heat resistance and adhesion
2Reliability
If flexible groups are introduced to improve adhesive performance, then adhesive performance is improved, but heat resistance deteriorates and coefficient of thermal expansion increases
Solution Approach 1:
The patent optimizes the mass ratio of curing agent to soluble polyimide within 0-20%, and controls the molecular structure parameters of the hydrazide-containing polyimide to achieve the optimal balance between adhesive performance and heat resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves excellent heat resistance, adhesive performance, and solubility, overcoming the limitations of existing polyimide-based adhesives during processing and application, and simplifies the synthesis process for large-scale industrial production.
Implementation Method 1
a soluble polyimide generated by a reaction of monomer groups containing aromatic tetracarboxylic dianhydride and diacid dihydrazide... and a curing agent which comprises one or more of multifunctional epoxy resin, a primary amine compound with three or more functional groups, and polyisocyanate
Data Source
AI summary
The present invention provides a resin composition, a polyimide preparation method and related products. The resin composition consists of the following components: polyimide which is a soluble product generated by a reaction of monomer groups containing aromatic tetracarboxylic dianhydride and diacid dihydrazide, a main chain of the polyimide containing a hydrazide structure; and a curing agent which comprises one or more of multifunctional epoxy resin, a primary amine compound with three or more functional groups, and polyisocyanate, wherein a mass ratio of the curing agent to the soluble polyimide is 0-20%. The resin composition in the present invention utilizes the hydrazide structure in the polyimide to prepare an adhesive with excellent heat resistance, adhesive performance, and solubility, overcoming the shortcomings of existing polyimide-based adhesives during processing or application.