Photosensitive Polyimide Black Matrix for Display Devices
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Solution Overview
Problem
Existing black matrices in display devices face challenges with high costs, environmental pollution, and inadequate light-shielding properties due to the use of chromium, and photosensitive resin compositions struggle to balance high resolution with mechanical properties.
Innovation Solution
A photosensitive resin composition incorporating an alkali-soluble polyimide resin with specific repeating units and a solvent, which enhances heat resistance, adhesion, and reduces out-gas generation, is used to create a black matrix for improved performance in electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If coloring pigments other than carbon black are used to prepare black composition, then environmental pollution and cost are reduced, but light-shielding property becomes weak requiring extremely large mixing amounts which increases viscosity and decreases film strength and adhesion
Solution Approach 1:
The patent uses a composite binder resin system combining polyimide resin and polyamide resin in specific proportions (polyimide: 10-50 wt%, polyamide: 50-90 wt%). This composite approach allows the use of alternative pigments while maintaining adequate film strength and adhesion through the synergistic properties of the two resin types, overcoming the weakness of individual pigments.
Solution Approach 2:
The patent optimizes the molecular weight parameters of the binder resins (polyimide: 10,000-50,000 g/mol, polyamide: 5,000-20,000 g/mol) and their mixing ratios to achieve the right balance between light-shielding property, viscosity, and film strength. By controlling these parameters, the composition can use alternative pigments without excessive viscosity increase while maintaining adequate adhesion.
2Temperature
If polyimide-based binder resin is used for interlayer insulating film, then mechanical properties and heat resistance are improved, but high resolution pattern formation becomes difficult with negative-type photosensitive polyimide
Solution Approach 1:
The patent creates a composite photosensitive system combining polyimide resin (for heat resistance) with polyamide resin and photosensitive components. This composite approach allows the material to maintain the heat resistance of polyimide while gaining the high-resolution patterning capability through the photosensitive system's positive-type photoresist behavior.
Solution Approach 2:
The patent controls the molecular weight of polyimide resin within 10,000-50,000 g/mol and optimizes the ratio of polyimide to polyamide resin, along with adding specific photosensitive components. These parameter changes enable the material to achieve both heat resistance and high-resolution pattern formation by tuning the photosensitivity and flow characteristics.
3Object-affected harmful factors
If chromium is deposited and etched to form black matrix pattern, then light-shielding property is achieved, but cost increases and environmental pollution occurs from chromium waste solution
Solution Approach 1:
The patent replaces expensive and environmentally harmful chromium metal deposition with a disposable organic polymer-based black matrix composition. This organic composition achieves the required light-shielding function without generating hazardous metal waste solutions, eliminating the need for costly chromium deposition and etching processes.
Solution Approach 2:
The patent substitutes the physical chromium metal deposition process with a chemical polymer-based composition that can be applied and processed through coating and photo patterning methods. This replaces the mechanical/physical chromium deposition and wet etching system with a chemical polymer processing system that is environmentally friendly and cost-effective.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a black matrix with enhanced heat resistance and reduced out-gas generation, improving the mechanical properties and process efficiency while maintaining high resolution and adhesion to substrates.
Implementation Method 1
R7 is hydrogen; deuterium; a hydroxyl group; a halogen group; a nitro group; a nitrile group; a substituted or unsubstituted alkyl group; a substituted or unsubstituted alkenyl group; a substituted or unsubstituted alkynyl group; a substituted or unsubstituted alkoxy group; a substituted or unsubstituted aryloxy group; a substituted or unsubstituted cycloalkyl group; a substituted or unsubstituted aryl group; or a photopolymerizable unsaturated group
Data Source
AI summary
The present disclosure relates to a photosensitive resin composition, a photosensitive material including the same, a black matrix including the same, and an electronic device including the same.