Polyimide Composition for Low Dielectric Electronic Substrates
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Solution Overview
Problem
Current polyimides used in electronic substrate materials have high dielectric constants and dielectric loss tangents, which hinder high-frequency signal transmission, and existing methods to reduce these properties often compromise mechanical strength, heat resistance, or introduce corrosion.
Innovation Solution
A polyimide composition is developed using a diamine component with 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindan and an acid component with 3,3',4,4'-biphenyltetracarboxylic acid dianhydride, maintaining high heat resistance and mechanical strength while lowering dielectric constants and dielectric loss tangents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional polyimides with polar imide groups are used, then mechanical strength and heat resistance are maintained, but dielectric constant and dielectric loss tangent become too high for high-frequency applications
Solution Approach 1:
The patent applies local quality by strategically placing polar imide groups only at specific locations in the polymer chain (through controlled copolymerization ratios), rather than uniformly distributing them. This allows the material to maintain necessary mechanical strength and heat resistance from the imide groups while reducing overall dielectric properties by having non-polar segments between the imide groups.
Solution Approach 2:
The patent uses composite materials by creating a copolymer system that combines polyimide segments (providing mechanical strength and heat resistance) with other polymer segments (reducing dielectric constant and loss tangent). This composite structure at the molecular level allows simultaneous achievement of conflicting properties.
2Object-affected harmful factors
If long-chain aliphatic structures are introduced to reduce dielectric constant, then dielectric properties improve, but mechanical strength and heat resistance deteriorate
Solution Approach 1:
The patent applies parameter changes by precisely controlling the ratio of copolymerization components and the length of aliphatic chains introduced. By optimizing these parameters, the material achieves the right balance where dielectric properties are improved through aliphatic chain introduction, but mechanical strength and heat resistance are preserved through controlled proportions and specific structural design.
3Object-affected harmful factors
If fluorine is introduced to lower dielectric constant, then dielectric properties improve, but corrosion and damage occur due to fluorine elimination during heating
Solution Approach 1:
The patent applies the taking out principle by removing the problematic fluorine atoms from the molecular structure while retaining the beneficial low-dielectric-effect. Instead of using fluorinated compounds that eliminate and cause corrosion, the patent achieves similar dielectric property improvement through alternative structural modifications (aliphatic chain introduction and copolymerization) that do not produce harmful elimination products.
4Object-affected harmful factors
If aliphatic ring structures are introduced to reduce dielectric loss tangent, then dielectric properties improve, but heat resistance decreases compared to aromatic ring structures
Solution Approach 1:
The patent applies local quality by introducing aliphatic ring structures only in limited proportions within the copolymer system, rather than using them as the primary structural motif. The aliphatic rings are localized in specific segments of the polymer chain, allowing dielectric loss tangent to be reduced while aromatic segments maintain the overall heat resistance of the material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting polyimide composition exhibits a relative dielectric constant of 3.0 or less and a dielectric loss tangent of 0.005 or less at 1 GHz, making it suitable for high-frequency electronic substrate materials with enhanced performance.
Implementation Method 1
condensation polymerization between aromatic diamine compounds and aromatic tetracarboxylic acid compounds followed by curing (imidization)
Implementation Method 2
lower dielectric constants and lower dielectric loss tangents as electronic substrate materials
Data Source
AI summary
There is provided a polyimide composition that is useful for electronic substrate materials, retains high heat resistance and mechanical strength intrinsic to polyimides, and has a lower dielectric constant and dielectric loss tangent. A polyimide composition for use in electronic substrate materials, containing a polyimide produced by polymerization between a diamine component containing 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindan and an acid component containing 3,3',4,4'-biphenyltetracarboxylic acid dianhydride.