Solvent-Soluble Polyimide Copolymer Synthesis

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Solution Overview

Problem

Conventional polyimide films are solvent-insoluble and have poor storage stability, making them difficult to modify and use in various applications due to their low solubility and rapid decomposition in water.

Innovation Solution

A novel three-step polycondensation process is developed to synthesize solvent-soluble four-component polyimides using specific imide oligomer intermediates and a catalyst system based on lactone equilibrium, allowing for the production of high-purity polyimide copolymers with improved thermal stability and solubility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional polyimide films are used, then high heat resistance is achieved, but solvent solubility is poor

Engineering Contradiction:
Improveheat resistanceVSAvoidsolvent solubility
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent creates a four-component copolymer system combining PMDA, BPDA, DADE, and DAT in specific ratios. This composite polymer structure integrates the high heat resistance of PMDA-DADE segments with the enhanced solubility characteristics of BPDA-DAT segments, achieving both thermal stability and processability in common solvents like chloroform and dimethylformamide

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The invention introduces local structural variation through the four-component copolymer architecture where different monomer units provide different functional properties. The BPDA-DAT segments contribute to solvent interaction and solubility, while PMDA-DADE segments maintain the core heat resistance, creating localized functional zones within the polymer chain

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If polyamic acid is used as intermediate, then polyimide film can be formed, but storage stability is poor due to water decomposition

Engineering Contradiction:
Improvefilm formation capabilityVSAvoidstorage stability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent performs the imidization reaction in advance during the polymerization process itself, converting the polyamic acid intermediate directly to the polyimide structure before film formation. This preliminary conversion eliminates the unstable polyamic acid from the final product, preventing water-induced decomposition during storage while maintaining film-forming capabilities

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention converts the potentially harmful polyamic acid intermediate, which is prone to water decomposition, into the beneficial polyimide structure through acid-catalyzed imidization. The harmful instability of the intermediate is transformed into a processing advantage, allowing direct conversion to the stable final product

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Productivity

If acid catalyst is used for polycondensation, then polyimide can be synthesized, but catalyst must be separated to prevent deterioration

Engineering Contradiction:
Improvepolycondensation efficiencyVSAvoidcatalyst removal complexity
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

The patent introduces water as an intermediary carrier for the acid catalyst. The catalyst is dissolved in water, which acts as a temporary medium during the polycondensation reaction. After completion, the water-based catalyst solution is easily separated from the organic polymer product through phase separation or evaporation, eliminating the need for complex catalyst removal procedures while maintaining high reaction efficiency

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The process results in polyimides with thermal decomposition onset temperatures of 500°C or more and no observed glass transition temperature up to 430°C, enabling their use in diverse applications such as high-heat electronic components, medical materials, and construction materials with enhanced storage stability.

Implementation Method 1

A polyimide film serving as a highly heat-resistant resin was first manufactured in 1960 by DuPont and called KAPTON, which consists of pyromellitic dianhydride (PMDA) and 1,4-diaminodiphenyl ether (DADE).

Methodology Applied
Scientific EffectDehydration reaction: Condensation

Implementation Method 2

Polyamic acids readily decompose in water so that they are poor storage stability.

Methodology Applied
Scientific EffectHydrolysis: Hydrolysis

Data Source

PatentUS8742031B2Solvent-soluble 6,6-polyimide copolymers and processes for preparing them
Publication Date: 2014.06.03 SOE WIN MAW
  • US8742031B2 patent drawing
  • US8742031B2 patent drawing
  • US8742031B2 patent drawing

AI summary

Heat-resistant polyimide copolymers having the following four components: pyromellitic dianhydride (PMDA), 1,4-diaminodiphenyl ether (DADE), biphenyltetracarboxylic dianhydride (BPDA), and 2,4-diaminotoluene (DAT) are provided. In an embodiment the molar ratio of (BPDA):(DADE):(PMDA):(DAT) is 2:2:m:m, in which m is an integer of 3, 4 or 5.