Polyimide Adhesive Curing via Vacuum-Assisted Gas Removal
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
During the curing process of a flexible display's polyimide adhesive, organic gases can become trapped in the curing chamber, leading to oxidation and condensation into particles on the substrate, causing defects due to inadequate gas discharge.
Innovation Solution
A curing apparatus and method that involves a chamber with an air extracting unit for evacuating organic gases at a first pressure, followed by a heating unit for removing gases and curing the adhesive, and optionally supplying nitrogen to reach a higher pressure for curing, with a cooling unit to manage temperature and pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large amount of N2 is continuously supplied during the curing process, then organic gases can be discharged and oxidation can be prevented, but eddies are easily produced in corners of the curing chamber, making gas discharge difficult and causing particle condensation on the substrate
Solution Approach 1:
The gas discharge function is segmented into multiple exhaust ports distributed at different positions (including corners) of the curing chamber, allowing localized gas removal without requiring complex continuous gas supply systems. This segmentation enables effective gas discharge while maintaining system simplicity.
Solution Approach 2:
Instead of continuously supplying N2 to discharge organic gases, the invention inverts the approach by evacuating the chamber to create negative pressure, which passively draws organic gases toward exhaust ports. This inversion eliminates the need for complex continuous gas supply while effectively preventing particle condensation.
2Reliability
If the curing chamber is evacuated to remove organic gases, then gas discharge is improved, but the curing process requires multiple stages (first heating, second heating) increasing process complexity
Solution Approach 1:
The chamber is evacuated before the curing process begins, and organic gases are removed during the first heating stage. This preliminary gas removal action prevents particle condensation issues that would otherwise require complex continuous gas supply systems throughout the entire curing process.
Solution Approach 2:
The curing process is divided into periodic stages: evacuation phase, first heating phase (200-300°C for gas removal), optional nitrogen refill phase, and second heating phase (400-500°C for curing). This periodic action systematically addresses gas removal and curing requirements while maintaining process control.
3Reliability
If the chamber is evacuated continuously, then organic gases are effectively discharged, but the process time is extended due to multiple heating stages required
Solution Approach 1:
Evacuation is performed as a preliminary action before curing begins, removing organic gases in advance. This allows the subsequent curing stages to proceed without interruption from gas management issues, effectively reducing total process time compared to continuous evacuation or continuous gas supply methods.
Solution Approach 2:
The first heating stage rapidly removes organic gases at 200-300°C, then the process quickly transitions to the second heating stage at 400-500°C for curing. This rushed-through approach to gas removal minimizes the time spent in the intermediate gas management phase while ensuring effective particle prevention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes organic gases, reduces the risk of condensation, shortens the process time, and improves the quality of the flexible substrate, thereby enhancing the performance of the flexible display device.
Implementation Method 1
an air extracting unit, configured for evacuating the chamber
Implementation Method 2
a heating unit, configured for performing a first heating on the substrate in the case that a first predetermined pressure is reached in the chamber during a evacuating process of the air extracting unit so as to remove organic gases from the polyimide adhesive, and performing a second heating on the substrate after the first heating so as to cure the polyimide adhesive
Implementation Method 3
the cooling unit cools the substrate by circulating nitrogen in the chamber
Data Source
AI summary
A curing apparatus and a curing method are provided. The curing apparatus comprises: a chamber, configured for accommodating a substrate provided with a polyimide adhesive; an air extracting unit, configured for evacuating the chamber; and a heating unit, configured for performing a first heating on the substrate in the case that a first predetermined pressure is reached in the chamber during a evacuating process of the air extracting unit so as to remove organic gases from the polyimide adhesive, and performing a second heating on the substrate after the first heating so as to cure the polyimide adhesive.